Study of fracture mechanics in testing interfacial fracture of solder joints

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 417-428

  Bang, W H ^a,b   Moon, M W ^a   Kim, C U ^b   Kang, S H ^a   Jung, J P ^c   Oh, K H ^a  

^a Seoul National University   (South Korea)

^b University of Texas at Arlington   (United States)

^c University of Seoul   (South Korea)

Author keywords

Bump shear test; Intermetallic layer; Solder joint reliability; Stress intensity factors (KI and KII); Tensile test

Indexed keywords

FRACTURE MECHANICS; LEAD COMPOUNDS; NUMERICAL ANALYSIS; SURFACE CHEMISTRY; VISCOPLASTICITY;

INTERMETALLIC LAYERS; SOLDER JOINT RELIABILITY;

SOLDERED JOINTS;

EID: 39849097280     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0393-8     Document Type: Article

References (20)

1. 1. A.J. Sunwoo J.W. Morris G.K. Lucey 1992 Metall. Trans. A 23A 1323 1:CAS:528:DyaK38XhvFyqtrg%3D A.J. Sunwoo, J.W. Morris, G.K. Lucey, Metall. Trans. A 23A, 1323 (1992)
2. 2. B.J. Lee N.M. Hwang H.M. Lee 1997 Acta Mater. 45 1867 10.1016/S1359-6454(96)00325-4 1:CAS:528:DyaK2sXivFOksLk%3D B.J. Lee, N.M. Hwang, H.M. Lee, Acta Mater. 45, 1867 (1997)
3. 3. R.J. Fields, R.R. Low, and G.K. Lucey, The Metal Science of Joining, ed. M.J. Cieslak, M.E. Glicksman, S. Kang, and J.␣Perepezko (Ohio: TMS, 1991), p. 165
4. 4. B. Balakrisnan C.C. Chum M. Li Z. Chen T. Cahyadi 2003 J. Electron. Mater. 32 166 10.1007/s11664-003-0188-x 1:CAS:528:DC%2BD3sXhvFGlsr0%3D B. Balakrisnan, C.C. Chum, M. Li, Z. Chen, T. Cahyadi, J. Electron. Mater. 32, 166 (2003)
5. 5. L.K. Quan D. Frear D. Grivas J.W. Morris 1987 J. Electron. Mater. 16 203 10.1007/BF02655488 1:CAS:528:DyaL2sXksVCmtL8%3D L.K. Quan, D. Frear, D. Grivas, J.W. Morris, J. Electron. Mater. 16, 203 (1987)
6. 6. R.J. Asaro N.P. O’Dowd C.F. Shih 1993 Mater. Sci. Eng. 162A 175 R.J. Asaro, N.P. O’Dowd, C.F. Shih, Mater. Sci. Eng. 162A, 175 (1993)
7. 7. H.-T. Lee M.-H. Chen 2002 Mater. Sci. Eng. A333 24 10.1016/S0921-5107(02)00087-9 1:CAS:528:DC%2BD38XksF2jsLc%3D H.-T. Lee, M.-H. Chen, Mater. Sci. Eng. A333, 24 (2002)
8. 8. K.H. Prakash T. Sritharan 2004 Mater. Sci. Eng. 379 277 10.1016/j.msea.2004.02.049 K.H. Prakash, T. Sritharan, Mater. Sci. Eng. 379, 277 (2004)
9. 9. L.K. Quan (MS Thesis, U.C. Berkeley, CA, 1988)
10. 10. JESD22-B117: BGA Bump Shear, Published by JEDEC Solid State Technology Association (Virginia: JEDEC, 2000)
11. 11. G.J. Irwin 1957 Appl. Mech. 24 361 G.J. Irwin, Appl. Mech. 24, 361 (1957)
12. 12. T.L. Anderson, Fracture Mechanics: Fundamentals and Applications, 2nd ed. (London: CRC Press, 1994), pp. 29–96
13. 13. J.-W. Kim S.-B. Jung 2004 Mater. Sci. Eng. A371 267 1:CAS:528:DC%2BD2cXjt1arsbg%3D J.-W. Kim, S.-B. Jung, Mater. Sci. Eng. A371, 267 (2004)
14. 14. X. Huang, S.-W.R. Lee, C.C. Yan, and S. Hui (Proceedings of 51st Electronic Components & Technology Conference, ECTC, Florida, 2001), p. 1065
15. 15. J. L. Marshall, The Mechanics of Solder Alloy Interconnects, ed. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau (New York: Van Nostraind Reinhold, 1994), p. 42
16. 16. E.W. Hare R.G. Stang 1995 J. Electron. Mater. 24 1473 10.1007/BF02655466 1:CAS:528:DyaK2MXosFygt7w%3D E.W. Hare, R.G. Stang, J. Electron. Mater. 24, 1473 (1995)
17. 17. Hibbit, Karlson & Sorensen: ABAQUS/Standard User’s Manual, Ver. 6.3 (2003), ch. 7.9
18. 18. ASTM E399-90: Standard Test Method for Plane Strain Fracture Toughness of Metallic Materials (ASTM, Philadelphia), (1990), E1290-02
19. 19. D.R. Frear P.T. Vianco 1994 Metall. Mat. Trans. 25A 1509 10.1007/BF02665483 1:CAS:528:DyaK2cXksVSntr0%3D D.R. Frear, P.T. Vianco, Met. Mat. Trans. 25A, 1509 (1994)
20. 20. D.B. Bogy 1971 J. Appl. Mech. 38 377 D.B. Bogy, J. Appl. Mech. 38, 377 (1971)