Lead-free bump interconnections for flip-chip applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 274-278

  Karim, Z S ^a   Schetty, R ^a  

^a Adv Interconnect Technology Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; TIN ALLOYS;

LEAD FREE BUMP INTERCONNECTION; TIN BISMUTH BUMP;

ELECTRONICS PACKAGING;

EID: 0034447090     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Lead-free soldering - Where the world is going
2. A period of adjustment: The effect of lead-free assembly on the semiconductor industry
3. Semiconductor packaging in 1999: Emerging trends