Bump formation for flip chip and CSP by solder paste printing

Microelectronics Reliability

Volumn 42, Issue 3, 2002, Pages 391-398

  Kloeser, Joachim ^a   Coskina, Paradiso ^b   Aschenbrenner, Rolf ^b   Reichl, Herbert ^b  

^a EKRA GmbH Maschinenfabrik   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; METALLIZING; SOLDERING; SOLDERING ALLOYS; WSI CIRCUITS;

BUMP METALLIZATION; SOLDER PASTE PRINTING;

FLIP CHIP DEVICES;

EID: 0036497091     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00223-2     Document Type: Article

References (9)

1. Low cost bumping by stencil printing process qualification for 200 μm pitch
2. Quality and yield of ultra fine pitch stencil printing for flip chip assembly
3. Wafer bumping by stencil printing
4. Reliability and fatigue life prediction of mounted CSP
5. Flip chip interconnection using redistribution technology
6. Solder paste printing guidelines for BGA and CSP assembly
7. Wafer bumping for wafer level CSP's and flip chips using stencil printing technology