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Volumn 59, Issue 15, 2011, Pages 6017-6028
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In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints
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Author keywords
Creep fatigue; Grain subdivision; In situ observation; SnAg Cu solder joints; Strain localization
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Indexed keywords
CREEP FATIGUE;
GRAIN SUBDIVISION;
IN SITU OBSERVATION;
SOLDER JOINTS;
STRAIN LOCALIZATION;
FATIGUE OF MATERIALS;
FATIGUE TESTING;
FRACTURE;
GRAIN BOUNDARY SLIDING;
MICROCRACKS;
PLASTIC DEFORMATION;
PLASTICITY;
SCANNING ELECTRON MICROSCOPY;
STRAIN;
STRAIN HARDENING;
TIN;
CREEP;
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EID: 79960981107
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2011.06.010 Document Type: Article |
Times cited : (59)
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References (35)
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