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Volumn 59, Issue 15, 2011, Pages 6017-6028

In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints

Author keywords

Creep fatigue; Grain subdivision; In situ observation; SnAg Cu solder joints; Strain localization

Indexed keywords

CREEP FATIGUE; GRAIN SUBDIVISION; IN SITU OBSERVATION; SOLDER JOINTS; STRAIN LOCALIZATION;

EID: 79960981107     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.06.010     Document Type: Article
Times cited : (59)

References (35)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.