Creep and high-temperature isothermal fatigue of Pb-free solders

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 955-960

  Zhang, Qian ^a   Dasgupta, Abhijit ^a   Haswell, Peter ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DATA REDUCTION; EUTECTICS; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; ISOTHERMS; STRAIN; THERMOMECHANICAL TREATMENT; TIN COMPOUNDS; COPPER ALLOYS; CREEP RESISTANCE; DROPS; DURABILITY; ELECTRONICS PACKAGING; LEAD; SILVER; SILVER ALLOYS; STRAIN RATE;

INELASTIC STRAIN; ISOTHERMAL FATIGUE; DAMAGE PROPAGATION; DURABILITY PERFORMANCE; EUTECTIC SOLDERS; HIGH TEMPERATURE; HOMOLOGOUS TEMPERATURE; LOAD DROPS; LOAD LEVELS; MECHANICAL DURABILITY; MECHANICAL TESTS; MICRO-STRUCTURAL; PB FREE SOLDERS; PB-FREE SOLDER ALLOYS; POWER-LAW; SN-3.5AG; SN-37PB; SN3.5AG SOLDER; TEST CONDITION; TEST SYSTEMS; THERMO-MECHANICAL;

SOLDERING ALLOYS;

EID: 1242309460     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35361     Document Type: Conference Paper

References (18)

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