Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times

Journal of Alloys and Compounds

Volumn 485, Issue 1-2, 2009, Pages 853-861

  Zhang, Q K ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Fracture mechanism; Interfacial IMCs; Sn 4Ag solder; Strain rate; Tensile properties

Indexed keywords

AG-ALLOY; AGING PROCESS; AGING TIME; FRACTURE MECHANISM; FRACTURE MECHANISMS; FRACTURE MORPHOLOGY; FRACTURE PROCESS; HIGH STRAIN RATES; INFLUENCING FACTOR; INTERFACIAL IMCS; INTERFACIAL MORPHOLOGIES; LOW STRAIN RATES; SOLDER JOINTS; TENSILE CURVE;

FRACTURE; FRACTURE MECHANICS; MORPHOLOGY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; TENSILE STRENGTH; TIN;

STRAIN RATE;

EID: 72049102629     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.06.108     Document Type: Article

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