The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder

Materials Characterization

Volumn 54, Issue 3, 2005, Pages 223-229

  Lang, Fengqun ^a   Tanaka, Hiroyuki ^b   Munegata, Osamu ^c   Taguchi, Toshihiko ^c   Narita, Toshio ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

^b HOKKAIDO INDUSTRIAL RESEARCH INSTITUTE   (Japan)

^c SENJU METAL INDUSTRY CO LTD   (Japan)

Author keywords

Lead free solders; Sn Ag alloys; Tensile properties; Transmission electron microscopy

Indexed keywords

CREEP; DIFFUSION; SENSITIVITY ANALYSIS; SOLDERING; STRAIN RATE; TENSILE PROPERTIES; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

FRACTURE MORPHOLOGIES; LEAD-FREE SOLDERS; SN-AG ALLOYS; SOLDER JOINTS;

TIN COMPOUNDS;

EID: 14544269363     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.11.013     Document Type: Article

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