Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

Materials Science and Engineering: A

Volumn 528, Issue 6, 2011, Pages 2711-2717

  Joo, Se Min ^a   Kim, Ho Kyung ^a  

^a Seoul National University of Science and Technology   (South Korea)

Author keywords

Lead free solder alloy; Miniature solder joint; Shear fracture mode; Unloading fracture toughness

Indexed keywords

COPPER ALLOYS; DISPLACEMENT CONTROL; LEAD ALLOYS; LEAD-FREE SOLDERS; SHEAR FLOW; SHEAR STRAIN; SHEAR STRESS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; STRAIN ENERGY; STRAIN RATE; TERNARY ALLOYS; TIN ALLOYS; UNLOADING;

FRACTURE MODE; LEAD-FREE SOLDER ALLOY; MINIATURE SOLDER JOINT; SHEAR FRACTURE; SHEAR FRACTURE MODE; SHEAR TESTS; SOLDER BALLS; SOLDER JOINTS; UNLOADING FRACTURE; UNLOADING FRACTURE TOUGHNESS;

FRACTURE TOUGHNESS;

EID: 79151470311     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.12.003     Document Type: Article

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