Effects of Ni additions, trace elements and solidification kinetics on microstructure formation in Sn-0.7Cu solder

Acta Materialia

Volumn 59, Issue 10, 2011, Pages 4197-4206

  Ventura, Tina ^a   Terzi, Sofiane ^a   Rappaz, Michel ^b   Dahle, Arne K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b EPFL   (Switzerland)

Author keywords

Bridgman technique; Directional solidification; Eutectic solidification; Soldering; Solidification

Indexed keywords

BRIDGMAN TECHNIQUES; CELLULAR MORPHOLOGY; COUPLED ZONE; CU ALLOY; DIRECTIONAL SOLIDIFICATION; DIRECTIONALLY SOLIDIFIED; EUTECTIC GROWTH; EUTECTIC MORPHOLOGY; EUTECTIC SOLIDIFICATION; HIGH-PURITY; IMPURITIES IN; MICROSTRUCTURE FORMATION; NI ADDITIONS; SN-0.7CU SOLDER; SOLIDIFICATION KINETICS;

BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; MORPHOLOGY; PHASE DIAGRAMS; SOLDERING; TIN; TIN ALLOYS; TRACE ELEMENTS;

SOLIDIFICATION;

EID: 79955566050     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.03.044     Document Type: Article

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