Guided three-dimensional catalyst folding during metal-assisted chemical etching of silicon

Nano Letters

Volumn 11, Issue 6, 2011, Pages 2369-2374

  Rykaczewski, Konrad ^a   Hildreth, Owen J ^b   Wong, Ching P ^b,c   Fedorov, Andrei G ^d   Scott, John Henry J ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3D nanofabrication; directed self assembly; focused ion beam patterning; metal assisted chemical etching

Indexed keywords

2D METAL; 3D NANOFABRICATION; 3D STRUCTURE; CATALYST LAYERS; DIRECTED SELF-ASSEMBLY; ETCHING RATE; FOCUSED ION BEAM PATTERNING; FOLDING PROCESS; LOW COSTS; METAL CATALYST; METAL-ASSISTED CHEMICAL ETCHING; NOTCHED BOUNDARY; SELECTIVE PATTERNING; SMALL REGION; THREE-DIMENSIONAL (3-D) FABRICATION; TRANSLATIONAL MOTIONS;

ETCHING; METALS; THREE DIMENSIONAL;

CATALYSTS;

GOLD; METAL NANOPARTICLE; SILICON;

ARTICLE; CATALYSIS; CHEMISTRY; PARTICLE SIZE; SURFACE PROPERTY;

CATALYSIS; GOLD; METAL NANOPARTICLES; PARTICLE SIZE; SILICON; SURFACE PROPERTIES;

EID: 79958855232     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl200715m     Document Type: Article

References (46)

1. Cui, Y.; Zhong, Z.; Wang, D.; Wang, W. U.; Lieber, C. M. Nano Lett. 2003, 3 (2) 149-152
2. Goldberger, J.; Hochbaum, A. I.; Fan, R.; Yang, P. Nano Lett. 2006, 6 (5) 973-977
3. Cui, L. F.; Ruffo, R.; Chan, C. K.; Peng, H.; Cui, Y. Nano Lett. 2008, 9 (1) 491-495
4. Hochbaum, A. I.; Chen, R.; Delgado, R. D.; Liang, W.; Garnett, E. C.; Najarian, M.; Majumdar, A.; Yang, P. Nature 2008, 451 (7175) 163-167
5. Cui, Y.; Wei, Q.; Park, H.; Lieber, C. M. Science 2001, 293 (5533) 1289-1292
6. Kelzenberg, M. D.; Boettcher, S. W.; Petykiewicz, J. A.; Turner-Evans, D. B.; Putnam, M. C.; Warren, E. L.; Spurgeon, J. M.; Briggs, R. M.; Lewis, N. S.; Atwater, H. A. Nat. Mater. 2010, 9 (3) 239-244
7. Peng, K. Q.; Wang, X.; Li, L.; Wu, X.-L.; Lee, S. T. J. Am. Chem. Soc. 2010, 132 (20) 6872-6873
8. Park, W. I.; Zheng, G.; Jiang, X.; Tian, B.; Lieber, C. M. Nano Lett. 2008, 8 (9) 3004-3009
9. Choi, W. K.; Liew, T. H.; Dawood, M. K.; Smith, H. I.; Thompson, C. V.; Hong, M. H. Nano Lett. 2008, 8 (11) 3799-3802
10. Morton, K. J.; Nieberg, G.; Bai, S.; Chou, S. Y. Nanotechnology 2008, 19 (34) 345301
11. Madou, M. J., Fundamentals of microfabrication: The science of Miniaturization, 2nd ed.; CRC: New York, 2002.
12. Huang, Z.; Geyer, N.; Werner, P.; de Boor, J.; Goösele, U. Adv. Mater. 2010, 23 (2) 285-308
13. Peng, K.; Lu, A.; Zhang, R.; Lee, S. T. Adv. Funct. Mater. 2008, 18 (19) 3026-3035
14. Chern, W.; Hsu, K.; Chun, I. S.; Azeredo, B. P. d.; Ahmed, N.; Kim, K.-H.; Zuo, J.-m.; Fang, N.; Ferreira, P.; Li, X. Nano Lett. 2010, 10 (5) 1582-1588
15. Chen, H.; Wang, H.; Zhang, X.-H.; Lee, C.-S.; Lee, S.-T. Nano Lett. 2010, 10 (3) 864-868
16. Tsujino, K.; Matsumura, M. Adv. Mater. 2005, 17 (8) 1045-1047
17. Tsujino, K.; Matsumura, M. Electrochem. Solid State Lett. 2005, 8 (12) C193-C195
18. Tsujino, K.; Matsumura, M. Electrochim. Acta 2007, 53, 28-34
19. Hildreth, O. J.; Lin, W.; Wong, C. P. ACS Nano 2009, 3 (12) 4033-4042
20. Chun, I. S.; Chow, E. K.; Li, X. L. Appl. Phys. Lett. 2008, 92 (19) 3
21. Rykaczewski, K.; Hildreth, O. J.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Adv. Mater. 2010, 23 (5) 659-663
22. Hildreth, O. J.; Wong, C. P. Adv. Funct. Mater. DOI: 10.1002/adfm. 201100279.
23. Rykaczewski, K.; Hildreth, O. J.; Kulkarni, D.; Henry, M. R.; Kim, S. K.; Wong, C. P.; Tsukruk, V. V.; Fedorov, A. G. ACS Appl. Mater. Interfaces 2010, 2 (4) 969-973
24. Gorostiza, P.; Diaz, R.; Kulandainathan, M. A.; Sanz, F.; Morante, J. R. J. Electroanal. Chem. 1999, 469 (1) 48-52
25. Chartier, C.; Bastide, S.; Levy-Clement, C. Electrochim. Acta 2008, 53 (17) 5509-5516
26. Li, X.; Bohn, W. P. Appl. Phys. Lett. 2000, 77 (16) 2572
27. Asoh, H.; Arai, F.; Ono, S. Electrochem. Commun. 2007, 9 (4) 535-539
28. Asoh, H.; Arai, F.; Uchibori, K.; Ono, S. Appl. Phys. Express 2008, 1 (6) 3
29. Huang, J.; Chiam, S. Y.; Tan, H. H.; Wang, S.; Chim, W. K. Chem. Mater. 2010, 22 (13) 4111-4116
30. Chang, S. W.; Chuang, V. P.; Boles, S. T.; Thompson, C. V. Adv. Funct. Mater. 2010, 20 (24) 4364-4370
31. Chang, S. W.; Chuang, V. P.; Boles, S. T.; Ross, C. A.; Thompson, C. V. Adv. Funct. Mater. 2009, 19 (15) 2495-2500
32. Harada, Y.; Li, X. L.; Bohn, P. W.; Nuzzo, R. G. J. Am. Chem. Soc. 2001, 123 (36) 8709-8717
33. Chattopadhyay, S.; Bohn, P. W. J. Appl. Phys. 2004, 96 (11) 6888-6894
34. Schmidt, O. G.; Eberl, K. Nature 2001, 410 (6825) 168-168
35. Prinz, V. Y.; Seleznev, V. A.; Gutakovsky, A. K.; Chehovskiy, A. V.; Preobrazhenskii, V. V.; Putyato, M. A.; Gavrilova, T. A. Phys. E (Amsterdam, Neth.) 2000, 6 (1 - 4) 828-831
36. Boncheva, M.; Whitesides, G. M. Adv. Mater. 2005, 17 (5) 553-557
37. Arora, W. J.; Nichol, A. J.; Smith, H. I.; Barbastathis, G. Appl. Phys. Lett. 2006, 88 (5) 3
38. Tyagi, P.; Bassik, N.; Leong, T. G.; Cho, J. H.; Benson, B. R.; Gracias, D. H. J. Microelectromech. Syst. 2009, 18 (4) 784-791
39. Stellman, P.; Buchner, T.; Arora, W. J.; Barbastathis, G. J. Microelectromech. Syst. 2007, 16 (4) 932-949
40. Bassik, N.; Stern, G. M.; Jamal, M.; Gracias, D. H. Adv. Mater. 2008, 20 (24) 4760-4764
41. Cho, J. H.; Gracias, D. H. Nano Lett. 2009, 9 (12) 4049-4052
42. Cho, J. H.; James, T.; Gracias, D. H. Adv. Mater. 2010, 22 (21) 2320-2324
43. Lezec, H. J.; Dionne, J. A.; Atwater, H. A. Science 2007, 316 (5823) 430-432
44. Bettinger, C. J.; Langer, R.; Borenstein, J. T. Angew. Chem. In. Ed. 2009, 48, 5406-5415
45. Randall, C. L.; Kalinin, Y. V.; Jamal, M.; Manohar, T.; Gracias, D. H. Lab Chip 2011, 11, 127-131
46. James, T.; Cho, J. H.; Fernandes, R.; Randhawa, J. S.; Gracias, D. H. Anal. Bioanal. Chem. 2010, 398 (7 - 8) 2949-2954