Curving nanostructures using extrinsic stress

Advanced Materials

Volumn 22, Issue 21, 2010, Pages 2320-2324

  Cho, Jeong Hyun ^a   James, Teena ^a   Gracias, David H ^a  

^a Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVED NANOSTRUCTURES; EXTRINSIC STRESS; FABRICATION METHODOLOGY; GRAIN COALESCENCE; ON-DEMAND; POST-DEPOSITION; PROCESSING STEPS; RADII OF CURVATURE; SELF ASSEMBLY PROCESS; SELF-ASSEMBLE; TO CURVE;

COALESCENCE; DEPOSITION; THIN FILMS; TIN;

NANOSTRUCTURES;

NANOMATERIAL; ARTIFICIAL MEMBRANE; MACROMOLECULE;

ARTICLE; ARTIFICIAL MEMBRANE; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; HEAT; MACROMOLECULE; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE; YOUNG MODULUS; PROCEDURES;

CRYSTALLIZATION; ELASTIC MODULUS; HOT TEMPERATURE; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; MOLECULAR CONFORMATION; NANOSTRUCTURES; NANOTECHNOLOGY; PARTICLE SIZE; STRESS, MECHANICAL; SURFACE PROPERTIES;

EID: 77953169196     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.200904410     Document Type: Article

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