Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 17, Issue 3, 2011, Pages 498-509

  Kopp, Christophe ^a   Bernabé, Stéphane ^a   Bakir, Badhise Ben ^a   Fedeli, Jean Marc ^a   Orobtchouk, Regis ^b   Schrank, Franz ^c   Porte, Henri ^d   Zimmermann, Lars ^e   Tekin, Tolga ^e  

^a MINATEC   (France)

^b UNIVERSITÉ DE LYON   (France)

^c AMS AG   (Austria)

^d IXblue   (France)

^e TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Hybrid IC packaging; optical fiber couplers; photonic integration; silicon on insulator (SOI)

Indexed keywords

CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; INTEGRATION; MICROELECTRONICS; OPTICAL FIBER COUPLING; OPTICAL FIBERS; PHOTONIC DEVICES; SILICON ON INSULATOR TECHNOLOGY; SILICON PHOTONICS; SILICON WAFERS; TIMING CIRCUITS;

ADVANCED PACKAGING; IC PACKAGING; MICROELECTRONICS INDUSTRY; OPTICAL FIBER COUPLER; OPTOELECTRONIC CIRCUITS; PHOTONIC INTEGRATIONS; SILICON ON INSULATOR (SOI); TECHNOLOGICAL PROCESS;

PHOTONIC INTEGRATION TECHNOLOGY;

COUPLING AGENTS; FIBERS; INTEGRATION; OPTICS; PACKAGING; SILICON COMPOUNDS;

EID: 79958283747     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2010.2071855     Document Type: Article

References (40)

1. R. Dangel, C. Berger, R. Beyeler, L. Dellmann, M. Gmur, R. Hamelin, F. Horst, T. Lamprecht, T. Morf, S. Oggioni, M. Spreafico, and B. Offrein, "Polymer-waveguide-based board-level optical interconnect technology for datacom applications", IEEE Trans. Adv. Packag., vol. 31, no. 4, pp. 759-767, Nov. 2008.
2. I. Kaminow, "Optical integrated circuits: A personal perspective", J. Lightw. Technol., vol. 26, no. 9, pp. 994-1004, May 2008.
3. J. M. Fedeli, R. Orobtchouk, C. Seassal, and L. Vivien, "Integration issues of a photonic layer on top of a CMOS circuit", Proc. SPIE, vol. 6125, pp. 97-111, 2006.
4. R. Baets, P. Dumon, W. Bogaerts, G. Roelkens, D. Taillaert, B. Luyssaert, G. Priem, G. Morthier, P. Bienstman, and D. Van-Thourhout, "Silicon- oninsulator based nano-photonics: Why, How, What for?" in Proc 2nd IEEE Int. Conf. Group IV Photon., 2005, pp. 168-170.
5. J. M. Fedeli, M. Migette, L. Di Cioccio, L. El Melhaoui, R. Orobtchouk, C. Seassal, P. Rojo Romeo, F. Mandorlo, D. Marris-Morini, and L. Vivien, "Incorporation of a photonic layer at the metallizations levels of a cmos circuit", in Proc 3rd IEEE Int. Conf. Group IV Photon., 2006, pp. 200-202.
6. J.-M. Fedeli, "Si and InP integration in the HELIOS project", in Proc.35th Eur. Conf. Opt. Commun. 2009, Vienna, Austria, pp. 1-3.
7. T. Pinguet, B. Analui, E. Balmater, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, Y. Liang, G. Masini, A. Mekis, S. Mirsaidi, A. Narasimha, M. Peterson, D. Rines, V. Sadagopan, S. Sahni, T. J. Sleboda, D. Song, Y. Wang, B. Welch, J. Witzens, J. Yao, S. Abdalla, S. Gloeckner, and P. De Dobbelaere, "Monolithically integrated high-speed CMOS photonic transceivers", in Proc 5th IEEE Int. Conf. Group-IV Photon., 2008, pp. 362-364.
8. T. Brenner and H. Melchior, "Integrated optical modeshape adapters in ingaasp/inp for efficient fiber-to-waveguide coupling", IEEE Photon. Technol. Lett., vol. 5, no. 9, pp. 1053-1056, Sep. 1993.
9. T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, "Spot-size converter for low-loss coupling between 0.3-mu m-square Si wire waveguides and single-mode fibers", in Proc. IEEE/LEOS Annu. Meet. Conf., 2002, pp. 289-290.
10. V. R. Almeida, R. Panepucci, and M. Lipson, "Nanotaper for compact mode conversion", Opt. Lett., vol. 28, no. 15, pp. 1302-1304, 2003.
11. K. Lee, D. R. Lim, D. Pan, C. Hoepfner, W-Y. Oh, K. Wada, L. C. Kimerling, K. P. Yap, and M. T. Doan, "Mode transformer for miniaturized optical circuits", Opt. Lett., vol. 30, no. 5, pp. 498-500, 2005. (Pubitemid 40339492)
12. G. Roelkens, P. Dumon, W. Bogaerts, D. Van-Thourhout, and R. Baets, "Efficient silicon-on-insulator fiber coupler fabricated using 248-nm-deep UV lithography", IEEE Photon. Technol. Lett., vol. 17, no. 12, pp. 2613-2615, Dec. 2005. (Pubitemid 41824564)
13. B. Ben Bakir, A. de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, "Low-loss (<1 dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers", IEEE Photon. Technol. Lett., vol. 22, no. 11, pp. 739-741, Jun. 2010.
14. [Online]. Available: http://www.epixfab.eu
15. D. Taillaert, F. Van Laere, M. Ayre, W. Bogaerts, D. Van Thourhout, P. Bienstman, and R. Baets, "Grating couplers for coupling between optical fibers and nanophotonic waveguides", Jpn. J. Appl. Phys., vol. 45, no. 8 A, pp. 6071-6077, 2006. (Pubitemid 44366829)
16. F. Van Laere, G. Roelkens, J. Schrauwen, D. Taillaert, P. Dumon, W. Bogaerts, D. Van Thourhout, and R. Baets, "Compact grating couplers between optical fibers and Silicon-on-Insulator photonic wire waveguides with 69% coupling efficiency", presented at the OFC 2006, pp. 2684-2686, Anaheim, CA.
17. R. Orobtchouk, A. Layadi, H. Gualous, D. Pascal, A. Koster, and S. Laval, "High-efficiency light coupling in a submicrometric silicon-on-insulator waveguide", Appl Opt., vol. 39, no. 31, pp. 5773-5777, 2000.
18. C. Kopp and A. Chelnokov, "Fiber grating couplers for silicon nanophotonic circuits: Design modeling methodology and fabrication tolerances", Opt. Commun., vol. 282, no. 21, pp. 4242-4248, 2009.
19. C. Kopp, T. Dupont, J.-M. Fedeli, and R. Orobtchouk, "Silicon photonics: Ready to wafer-bonding fiber grating coupler", presented at the SPIE, San Francisco, CA, 2010.
20. S. K. Selvaraja, D. Vermeulen, M. Schaekers, E. Sleeckx, W. Bogaerts, G. Roelkens, P. Dumon, D. Van-Thourhout, and R. Baets, "Highly efficient grating coupler between optical fiber and silicon photonic circuit", presented at the 2009 Conf. Lasers Electro-Opt., Baltimore, Maryland, 2009.
21. M. J. Schabel and A. M. Lyons, "Microphotonics, hardware for the information age, current state of the photonics industry", MIT Microphotonics center Communications Technology Roadmap, 2005. Available: http://www.signallake.com/innovation/MicrophotonicsCommRoadmap2005.pdf
22. S. Bernabé, "Advanced packaging concepts for low-cost optoelectronic devices", Proc. SPIE, vol. 6350, pp. 635008-1-635008-9, 2006 (EPIC Workshop 2006, Stockholm).
23. B. Velsher, "Application-specific optoelectronic packaging", in Proc. ECTC 2002, pp. 794-800.
24. L. Zimmermann, T. Tekin, W. Bogaerts, and P. Dumon, "G-Pack-A generic testbed package for Silicon photonics devices", in Proc. Group IV Photon., 2008, Italy, pp. 371-373.
25. C. Kopp, M. Volpert, J. Routin, S. Bernabé, C. Rossat, M. Tournaire, and R. Hamelin, "Merging parallel optics packaging and surface mount technology", Proc. SPIE, vol. 6899, pp. 68990Y-1-68990Y-8, 2008.
26. S. Bernabé, C. Kopp, L. Lombard, and J. M. Fedeli, "Microelectronic-like packaging for silicon photonics: A 10 Gbps multi-chip-module optical receiver based on Ge-on-Si photodiode", presented at the ESTC, Berlin, Germany, 2010.
27. D. Li, T. Zheng, E. Zbinden, S. Yegnanamyanan, J. Chen, J. Bennett, M. Finot, E. Askew, J. Walker, H. Nguyen, M. Epitaux, J. P. Weerm, and J. Verdiell, "Process development for 10 gb/s small footprint butterfly transmitter", in Proc. 53rd Electron. Compon. Technol. Conf., Las Vegas, Apr. 2003, pp. 296-300.
28. R. A. Boudreau and S. M. Boudreau, Passive Micro-Optical Alignment Methods. Boca Raton, FL: Taylor and Francis, 2005.
29. S. H. Lee and Y. C. Lee, "Optoelectronic packaging for optical interconnects", OPN, vol. 17, no. 1, pp. 40-45, Jan. 2006. (Pubitemid 43242520)
30. D. F. Welch, F. A. Kish, S. Melle, R. Nagarajan, M. Kato, C. H. Joyner, J. L. Pleumeekers, R. P. Schneider, J. Back, A. G. Dentai, V. G. Dominic, P. W. Evans, M. Kauffman, D. J. H. Lambert, S. K. Hurtt, A. Mathur, M. L. Mitchell, M. Missey, S. Murthy, A. C. Nilsson, R. A. Salvatore, M. F. Van Leeuwen, J. Webjorn, M. Ziari, S. G. Grubb, D. Perkins, M. Reffle, and D. G. Mehuys, "Large-scale InP photonic integrated circuits: enabling efficient scaling of optical transport networks", IEEE J. Sel. Topics Quant. Electron., vol. 13, no. 1, pp. 22-31, Jan./Feb. 2007.
31. B. T. Smith, D. Feng, H. Lei, D. Zheng, J. Fong, P. Zhou, and M. Asghari, "Progress in manufactured silicon photonics", Proc. SPIE, vol. 6477, pp. 647702-1-647702-9, 2007.
32. K. Yamauchi, K. Kurata, M. Kurihara, Y. Sano, and Y. Sato, "Automated mass production line for optical modules using passive alignment technique", in Proc ECTC, 2000, pp. 15-20. (Pubitemid 32134776)
33. D. W. Vernooy, J. S. Paslaski, H. A. Blauvelt, R. B. Lee, and K. J. Vahala, "Alignment insensitive coupling for PLC based surface mount photonics", IEEE Photon. Techno. Lett., vol. 16, no. 1, pp. 269-271, Jan. 2004.
34. C. Kopp, P. Grosse, K. Gilbert, and J. M. Fedeli, "Silicon photonics packaging: Characterization of a waveguide grating coupler and modeling of the fiber coupling ratio", Proc. SPIE, vol. 6478, pp. 64780N-1-64780N-9, 2007.
35. L. Zimmermann, T. Tekin, H. Schroeder, P. Dumon, and W. Bogaerts. (2009, Dec.). How to bring nanophotonics to application-Silicon photonics packaging. IEEE LEOS Newsletter.
36. D. Taillaert, H. Chong, P. I. Borel, L. H. Frandsen, R. M. De La Rue, and R. Baets, "A compact two-dimensional grating coupler used as a polarization splitter", IEEE Photon. Technol. Lett., vol. 15, no. 9, pp. 1249-1251, Sep. 2003.
37. "PLC for connecting optical fibers to optical or optoelectronic devices", U. S. Patent 7366380, 2008.
38. R. Hauffe, U. Siebel, K. Petermann, R. Moosburger, J. R. Kropp, and F. Arndt, "Methode for passive chip coupling of integrated devices", in Proc. ECTC 2000, pp. 238-243.
39. M. De Labachelerie, N. Kaou, V. Armbruster, J.-C. Jeannot, P. Mollier, H. Porte, and N. Devoldère, "A micromachined connector for the coupling of optical waveguides and ribbon optical fibers", Sens. Actuators, vol. 2847, pp. 1-7, 2000.
40. C. Kopp, S. Bernabé, and P. Philippe, "Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices", in Proc. ECTC, San Diego, 2009, pp. 1914-1919.