Optoelectronic packaging for optical interconnects

Optics and Photonics News

Volumn 17, Issue 1, 2006, Pages 40-45

  Lee, Sing H ^a   Lee, Y C ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of Colorado at Boulder   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; HEAT SINKS; MICROELECTROMECHANICAL DEVICES; OPTICAL INTERCONNECTS; PHOTODETECTORS; SEMICONDUCTOR LASERS;

CONNECTION DENSITIES; MICROELECTROMECHANICAL SYSTEMS (MEMS); OPTOELECTRONICS PACKAGING; RECEIVER ELECTRONICS;

OPTOELECTRONIC DEVICES;

EID: 32644437097     PISSN: 10476938     EISSN: None     Source Type: Trade Journal    
DOI: 10.1364/OPN.17.1.000040     Document Type: Review

References (14)

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