Advanced packaging concepts for low-cost optoelectronic devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6350, Issue , 2006, Pages

  Bernabé, Stéphane ^a  

^a Intexys Photonics 17 ^*  (France)

Author keywords

Advanced packaging; Optoelectronic packaging; Passive alignment

Indexed keywords

ADVANCED PACKAGING; FLIP-CHIP HYBRIDIZATION; OPTOELECTRONIC PACKAGING; PASSIVE ALIGNMENT;

ELECTRONICS PACKAGING; FIBER OPTICS; FLIP CHIP DEVICES; MICROOPTICS; OPTICAL COMMUNICATION; OPTICAL LINKS;

OPTOELECTRONIC DEVICES;

EID: 33749857738     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.693049     Document Type: Conference Paper

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