Methods for passive fiber chip coupling of integrated optical devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 238-243

  Hauffe, R ^a   Siebel, U ^a   Petermann, K ^a   Moosburger, R ^b   Kropp, J R ^c   Arndt, F ^d  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b Virtual Photonics Incorporated   (Germany)

^c INFINEON TECHNOLOGIES AG   (Germany)

^d SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LITHOGRAPHY; OPTICAL FIBERS; OPTICAL WAVEGUIDES; SILICON ON INSULATOR TECHNOLOGY; WAVELENGTH DIVISION MULTIPLEXING;

INTEGRATED OPTICAL DEVICES; PASSIVE FIBER CHIP COUPLING;

INTEGRATED OPTOELECTRONICS;

EID: 0034480148     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)