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Volumn , Issue , 2003, Pages 296-300

Process development for 10 Gb/s small footprint butterfly transmitter

Author keywords

[No Author keywords available]

Indexed keywords

LOCAL AREA NETWORKS; OPTICAL DESIGN; PROCESS ENGINEERING; TRANSCEIVERS; TRANSMITTERS; WIDE AREA NETWORKS;

EID: 0038006008     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (12)
  • 3
    • 0038479237 scopus 로고    scopus 로고
    • Automated opto-electronic packaging technology for small form factor 10 Gb/s optical modules
    • Phopak
    • Marc Finot et al., Automated Opto-electronic Packaging Technology for Small Form Factor 10 Gb/s Optical Modules, Phopak.
    • Finot, M.1
  • 4
    • 0032146217 scopus 로고    scopus 로고
    • D. Ivey, Micron vol. 29, No.4, pp.281-287 (1998).
    • (1998) Micron , vol.29 , Issue.4 , pp. 281-287
    • Ivey, D.1
  • 8
    • 0020498208 scopus 로고
    • The quality of die attachment and its relationship to strength and vertical die cracking
    • C.G. M. Van Kessel, S.A. Gee, and J.J. Murphy, The quality of die attachment and its relationship to strength and vertical die cracking, Proc. 33rd ECTC, 33, 237 (1983).
    • (1983) Proc. 33rd ECTC , vol.33 , pp. 237
    • Van Kessel, C.G.M.1    Gee, S.A.2    Murphy, J.J.3
  • 9
    • 0038140317 scopus 로고    scopus 로고
    • Laser diode packaging technology: Coaxial module assembly application notes #7 - Newport corporation
    • Mobarhan, K. S., Jang, S., Heyler, R., "Laser Diode Packaging Technology: Coaxial Module Assembly Application Notes #7 - Newport Corporation
    • Mobarhan, K.S.1    Jang, S.2    Heyler, R.3
  • 10
    • 0037514217 scopus 로고    scopus 로고
    • Wire bonding optoelectronic packages
    • Nov.
    • L. Levine, "Wire Bonding optoelectronic packages", Chip scale review, Nov. 2001
    • (2001) Chip Scale Review
    • Levine, L.1
  • 12
    • 0037802704 scopus 로고    scopus 로고
    • Automated ribbon bonding
    • July
    • Laurie S. Roth et al, Automated ribbon bonding, Advanced Packaging, July 2001, pp.49-52.
    • (2001) Advanced Packaging , pp. 49-52
    • Roth, L.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.