Merging parallel optics packaging and surface mount technologies

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6899, Issue , 2008, Pages

  Kopp, Christophe ^a   Volpert, Marion ^a   Routin, Julien ^a   Bernabé, Stéphane ^b   Rossat, Cyrille ^b   Tournaire, Myriam ^b   Hamelin, Régis ^b  

^a CEA LETI   (France)

^b INTEXYS PHOTONICS ^*  (France)

Author keywords

Datacom; Optical interconnects; Packaging; Parallel optics; Transceiver

Indexed keywords

INTEGRATED CIRCUITS; OPTICAL INTERCONNECTS; OPTICAL LINKS; PRINTED CIRCUIT BOARDS; TRANSCEIVERS;

ELECTRICAL LINKS; PARALLEL OPTICS PACKAGING;

ELECTRONICS PACKAGING;

EID: 43249114426     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.761609     Document Type: Conference Paper

References (11)

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