Silicon photonics: Ready to wafer-bonding fibre grating coupler

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7606, Issue , 2010, Pages

  Kopp, Christophe ^a   Dupont, Tiphaine ^a   Fédéli, Jean Marc ^a   Orobtchouk, Régis ^b  

^a CEA LETI   (France)

^b UNIVERSITÉ DE LYON   (France)

Author keywords

Fibre coupling; Grating; Integration; Packaging; Silicon photonics

Indexed keywords

COMPATIBLE DESIGN; ENCAPSULATION LAYER; FIBRE COUPLING; FIBRE GRATINGS; FUNCTIONAL INTEGRATION; GRATING; IC WAFERS; MIRROR STRUCTURE; NANOPHOTONIC CIRCUITS; OPTICAL LAYERS; OPTICAL STRUCTURES; PERFORMANCE OF FIBRES; SENSITIVE PARAMETER; SILICON PHOTONICS; WAFER TO WAFER BONDING;

FIBERS; LINEAR MOTORS; MICROELECTRONICS; MIRRORS; NANOPHOTONICS; PHOTONIC DEVICES; PHOTONICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

WAFER BONDING;

EID: 77951683412     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.839679     Document Type: Conference Paper

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