Polymer-waveguide-based board-level optical interconnect technology for datacom applications

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 4, 2008, Pages 759-767

  Dangel, Roger ^a   Berger, Christoph ^a   Beyeler, Reńe ^a   Dellmann, Laurent ^a   Gmür, Max ^b   Hamelin, Régis ^c   Horst, Folkert ^a   Lamprecht, Tobias ^a   Morf, Thomas ^a   Oggioni, Stefano ^d   Spreafico, Mauro ^d   Offrein, Bert Jan ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b Varioprint AG   (Switzerland)

^c Intexys Photonics ^*  (France)

^d IBM   (Italy)

Author keywords

Assembly; Connectors; Fabrication; High speed integrated circuits; Laser machining; Multimode waveguides; Optical interconnections; Optical polymers; Optical receivers; Optical transmitters; Reliability; Technology

Indexed keywords

ACOUSTIC RECEIVERS; DIFFERENTIAL AMPLIFIERS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONIC EQUIPMENT MANUFACTURE; FABRICATION; INTEGRATED CIRCUITS; INTEGRATED OPTICS; LASERS; MACHINING; MODULAR CONSTRUCTION; NETWORKS (CIRCUITS); OPTICAL INTERCONNECTS; OPTICAL RECEIVERS; OPTOELECTRONIC DEVICES; PHOTORESISTS; POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; SURFACE EMITTING LASERS; TECHNOLOGY; TRANSMITTERS; WAVEGUIDE COMPONENTS; WAVEGUIDE COUPLERS; WAVEGUIDES;

CONNECTORS; HIGH-SPEED INTEGRATED CIRCUITS; LASER MACHINING; MULTIMODE WAVEGUIDES; OPTICAL INTERCONNECTIONS; OPTICAL POLYMERS; OPTICAL TRANSMITTERS;

OPTICAL WAVEGUIDES;

EID: 57749093126     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2005996     Document Type: Conference Paper

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