A microcantilever platform for measuring internal friction in thin films using thermoelastic damping for calibration

Journal of Microelectromechanical Systems

Volumn 20, Issue 3, 2011, Pages 764-773

  Sosale, Guruprasad ^a   Prabhakar, Sairam ^a   Frechette, Luc G ^b   Vengallatore, Srikar ^a  

^a MCGILL UNIVERSITY   (Canada)

^b UNIVERSITÉ DE SHERBROOKE   (Canada)

Author keywords

Damping; internal friction (IF); microcantilever platform; thin films

Indexed keywords

ACCURATE MEASUREMENT; ANELASTICITY; FREE PARAMETERS; FREE SURFACES; FUNDAMENTAL LIMITS; GOLD FILM; METAL-COATED; MICRO ELECTRO MECHANICAL SYSTEM; MICROCANTILEVER PLATFORMS; ROOM TEMPERATURE; SILICON BEAMS; SILICON MICROCANTILEVERS; STRUCTURAL DAMPING; THERMOELASTIC DAMPING; VIBRATION ENERGY HARVESTING;

ALUMINUM; CHEMICAL SENSORS; COMPOSITE MICROMECHANICS; DAMPING; ELASTIC WAVES; ENERGY HARVESTING; INTERNAL FRICTION; MEMS; MICROELECTROMECHANICAL DEVICES; THERMOELASTICITY; THIN FILMS; TRIBOLOGY;

SILVER;

EID: 79957973854     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2140357     Document Type: Article

References (49)

1. G. Sosale, S. Prabhakar, L. Fréchette, and S. Vengallatore, "Effect of thin aluminum coatings on structural damping of silicon microresonators," in Proc. Mater. Res. Soc. Symp., 2010, vol. 1222, pp. 83-88.
2. K. Y. Yasumura, T. D. Stowe, E. M. Chow, T. Pfafman, T. W. Kenny, B. C. Stipe, and D. Rugar, "Quality factors in micro-and submicronthick cantilevers," J. Microelectromech. Syst., vol. 9, no. 1, pp. 117-125, Mar. 2000. (Pubitemid 30581703)
3. M. Li, H. X. Tang, and M. L. Roukes, "Ultra-sensitive NEMS-based cantilevers for sensing, scanned probe and very high-frequency applications," Nat. Nanotechnol., vol. 2, no. 2, pp. 114-120, Feb. 2007. (Pubitemid 46226371)
4. N. V. Lavrik, M. J. Sepaniak, and P. G. Datskos, "Cantilever transducers as a platform for chemical and biological sensors," Rev. Sci. Instrum., vol. 75, no. 7, pp. 2229-2253, Jul. 2004.
5. A. S. Nowick and B. S. Berry, Anelastic Relaxation in Crystalline Solids. New York: Academic, 1972.
6. M. S. Blanter, I. S. Golovin, H. Neuhauser, and H.-R. Sinning, Internal Friction in Metallic Materials. New York: Springer-Verlag, 2007.
7. T. H. Metcalf, B. B. Pate, D. M. Photiadis, and B. H. Houston, "Thermoelastic damping in micromechanical resonators," Appl. Phys. Lett., vol. 95, no. 6, pp. 061903-1-061903-3, Aug. 2009.
8. A. Duwel, J. Gorman, M. Weinstein, J. Borenstein, and P. Ward, "Experimental study of thermoelastic damping in MEMS gyros," Sens. Actuators A, Phys., vol. 103, no. 1/2, pp. 70-75, Jan. 2003.
9. V. T. Srikar and S. D. Senturia, "Thermoelastic damping in fine-grained polysilicon flexural beam resonators," J. Microelectromech. Syst., vol. 11, no. 5, pp. 499-504, Oct. 2002. (Pubitemid 35242054)
10. R. Abdolvand, H. Johari, G. K. Ho, A. Erbil, and F. Ayazi, "Quality factor in trench-refilled polysilicon beam resonators," J. Microelectromech. Syst., vol. 15, no. 3, pp. 471-478, Jun. 2006. (Pubitemid 43891341)
11. S. Evoy, A. Olkhovets, L. Sekaric, J. Parpia, H. G. Craighead, and D. W. Carr, "Temperature-dependent internal friction in silicon nanoelectromechanical systems," Appl. Phys. Lett., vol. 77, no. 15, pp. 2397-2399, Oct. 2000.
12. L. Sekaric, D. W. Carr, S. Evoy, J. M. Parpia, and H. G. Craighead, "Nanomechanical resonant structures in silicon nitride: Fabrication, operation and dissipation issues," Sens. Actuators A, Phys., vol. 101, no. 1/2, pp. 215-219, Sep. 2002.
13. R. Sandberg, K. Molhave, A. Boisen, and W. Svendsen, "Effect of gold coating on the Q-factor of a resonant cantilever," J. Micromech. Microeng., vol. 15, no. 12, pp. 2249-2253, Dec. 2005. (Pubitemid 41677091)
14. A. R. Klempner, R. T. Marinis, P. Hefti, and R. J. Pryputniewicz, "Experimental determination of the Q-factors of microcantilevers coated with thin metal films," Strain, vol. 45, no. 3, pp. 295-300, Jun. 2009.
15. S. Suresh and L. B. Freund, Thin Film Materials. Cambridge, U.K.: Cambridge Univ. Press, 2003.
16. G. P. Weiss and D. O. Smith, "Measurement of internal friction in thin films," Rev. Sci. Instrum., vol. 34, no. 5, pp. 522-523, May 1963.
17. B. S. Berry and W. C. Pritchet, "Vibrating reed internal friction apparatus for films and foils," IBM J. Res. Develop., vol. 19, no. 4, pp. 334-343, Jul. 1975.
18. B. S. Berry and W. C. Pritchet, "Effect of interdiffusion on the elasticity and internal friction of compositionally modulated copper-nickel thin films," Thin Solid Films, vol. 33, no. 1, pp. 19-28, Mar. 1976.
19. B. S. Berry and W. C. Pritchet, "Defect studies of thin layers by the vibrating-reed technique," J. Phys., vol. 42, no. supplement 10, pp. 1111-1122, 1981, coll. C5.
20. B. S. Berry and W. C. Pritchet, "Extended capabilities of a vibrating-reed internal friction apparatus," Rev. Sci. Instrum., vol. 54, no. 2, pp. 254-256, Feb. 1983. (Pubitemid 13506484)
21. B. S. Berry andW. C. Pritchet, "Internal stress and internal friction in thinlayer microelectronic materials," J. Appl. Phys., vol. 67, no. 8, pp. 3661-3668, Apr. 1990.
22. H. G. Bohn and C. M. Su, "Characterization of thin films by internal friction measurements," in Proc. Mater. Res. Soc. Symp., 1992, vol. 239, pp. 215-225.
23. C. M. Su and M. Wuttig, "Internal friction in thin films and membranes," J. Alloys Compd., vol. 211/212, pp. 428-433, Sep. 1994.
24. M. Prieler, H. G. Bohn, W. Schilling, and H. Trinkaus, "Grain boundary sliding in thin substrate-bonded Al films," J. Alloys Compd., vol. 211/212, pp. 424-427, Sep. 1994.
25. K. Fujiwara, H. Tanimoto, and H. Mizubayashi, "Elasticity study of very thin Cu films," Mater. Sci. Eng. A, vol. 442, no. 1/2, pp. 336-341, Dec. 2006. (Pubitemid 44762984)
26. V. Pelosin, K. F. Badawi, and V. Branger, "Internal friction and its evolution measured on very thin platinum films," Appl. Phys. Lett., vol. 66, no. 6, pp. 691-693, Feb. 1995.
27. Y. Nishino, Y. Ota, and T. Kawazoe, "Amplitude-dependent internal friction in copper thin films on silicon substrate," Mater. Sci. Eng. A, vol. 370, no. 1/2, pp. 146-149, Apr. 2004. (Pubitemid 38463178)
28. Y. Nishino and K. Ikai, "Internal friction study of microplasticity in polycrystalline gold thin films," Mater. Sci. Eng. A, vol. 442, no. 1/2, pp. 347-351, Dec. 2006. (Pubitemid 44763018)
29. D. H. Choi and W. D. Nix, "Anelastic behavior of copper thin films on silicon substrates: Damping associated with dislocations," Acta Mater., vol. 54, no. 3, pp. 679-687, Feb. 2006. (Pubitemid 43040051)
30. D. H. Choi, H. Kim, and W. D. Nix, "Anelasticity and damping of thin aluminum films on silicon substrates," J. Microelectromech. Syst., vol. 13, no. 2, pp. 230-237, Apr. 2004.
31. J. Von Der Hagen, M. Weller, and E. Arzt, "Internal friction of copper thin layers on silicon substrates," Defect Diffusion Forum, vol. 203-205, pp. 285-288, 2002. (Pubitemid 34220516)
32. A. W. Zhu, H. G. Bohn, and W. Schilling, "Internal friction associated with grain boundary diffusion in gold films," Philos. Mag. A, vol. 72, pp. 805-812, 1995.
33. S. Vengallatore, "Analysis of thermoelastic damping in laminated composite micromechanical beam resonators," J. Micromech. Microeng., vol. 15, no. 12, pp. 2398-2404, Dec. 2005. (Pubitemid 41677108)
34. H. Hosaka, K. Itao, and S. Kuroda, "Damping characteristics of beamshaped micro-oscillators," Sens. Actuators A, Phys., vol. 49, no. 1/2, pp. 87-95, Jun. 1995.
35. Z. Hao, A. Erbil, and F. Ayazi, "An analytical model for support loss in micromachined beam resonators with in-plane flexural vibrations," Sens. Actuators A, Phys., vol. 109, no. 1/2, pp. 156-164, Dec. 2003.
36. D. M. Photiadis and J. A. Judge, "Attachment losses of high Q oscillators," Appl. Phys. Lett., vol. 85, no. 3, pp. 482-484, Jul. 2004.
37. A. T. Ferguson, L. Li, V. T. Nagaraj, B. Balachandran, B. Piekarski, and D. L. DeVoe, "Modeling and design of composite free-free beam piezoelectric resonators," Sens. Actuators A, Phys., vol. 118, no. 1, pp. 63-69, Jan. 2005.
38. C. Zener, "Internal friction in solids I: Theory of internal friction in reeds," Phys. Rev., vol. 52, no. 3, pp. 230-235, Aug. 1937.
39. C. Zener, "Internal friction in solids II: General theory of thermoelastic internal friction," Phys. Rev., vol. 53, no. 1, pp. 90-99, Jan. 1938.
40. V. K. Kinra and K. B. Milligan, "A second-law analysis of thermoelastic damping," J. Appl. Mech., vol. 61, no. 1, pp. 71-76, Mar. 1994.
41. R. Lifshitz and M. Roukes, "Thermoelastic damping in micro-and nanomechanical systems," Phys. Rev. B, Condens. Matter, vol. 61, no. 8, pp. 5600-5609, Feb. 2000.
42. S. Prabhakar and S. Vengallatore, "Theory of thermoelastic damping in micromechanical resonators with two-dimensional heat conduction," J. Microelectromech. Syst., vol. 17, no. 2, pp. 494-502, Apr. 2008.
43. M. Ohring, Materials Science of Thin Films, 2nd ed. New York: Academic, 2002.
44. S. Prabhakar and S. Vengallatore, "Thermoelastic damping in bilayer composite micromechanical beam resonators," J. Micromech. Microeng., vol. 15, pp. 2398-2404, 2005. (Pubitemid 41677108)
45. J. S. Bendat and A. G. Piersol, Random Data Analysis and Measurement. New York: Wiley-Interscience, 2000.
46. C. B. Smith and N. M. Wereley, "Transient analysis for damping identification in rotating composite beams with integral damping layers," Smart Mater. Struct., vol. 5, no. 5, pp. 540-550, Oct. 1996. (Pubitemid 126649191)
47. W. A. Brantley, "Calculated elastic constants for stress problems associated with semiconductor devices," J. Appl. Phys., vol. 44, no. 1, pp. 534-535, Jan. 1973.
48. J. Yang, T. Ono, and M. Esashi, "Surface effects and high quality factors in ultrathin single-crystal silicon cantilevers," Appl. Phys. Lett., vol. 77, no. 23, pp. 3860-3862, Dec. 2000.
49. X. Liu, E. Thompson, B. E. White, and R. O. Pohl, "Low-temperature internal friction in metal films and in plastically deformed aluminum," Phys. Rev. B, Condens. Matter, vol. 59, no. 18, pp. 11 767-11 776, May 1999.