Thermoelastic damping in fine-grained polysilicon flexural beam resonators

Journal of Microelectromechanical Systems

Volumn 11, Issue 5, 2002, Pages 499-504

  Srikar, V T ^b   Senturia, Stephen D ^a,b  

^a IEEE   (United States)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Grain size; Intracrystalline; Quality factor; RF MEMS; Thermoelastic damping

Indexed keywords

INTRACRYSTALLINE; POLYSILICON FLEXURAL BEAM RESONATORS; QUALITY FACTOR; THERMOELASTIC DAMPING;

CRYSTAL RESONATORS; DAMPING; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; POLYSILICON; THERMOELASTICITY;

MICROELECTROMECHANICAL DEVICES;

EID: 0036772239     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.802902     Document Type: Article

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