Quality factors in micron- and submicron-thick cantilevers

Journal of Microelectromechanical Systems

Volumn 9, Issue 1, 2000, Pages 117-125

  Yasumura, Kevin Y ^a,b   Stowe, Timothy D ^a,b   Chow, Eugene M ^a,b   Pfafman, Timothy ^b   Kenny, Thomas W ^a,b   Stipe, Barry C ^c   Rugar, Daniel ^c  

^a STANFORD UNIVERSITY   (United States)

^b Stanford University   (United States)

^c IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; ATOMIC FORCE MICROSCOPY; FORCE MEASUREMENT; HEAT TREATMENT; MICROSENSORS; NITROGEN; SILICON NITRIDE; SINGLE CRYSTALS; SPURIOUS SIGNAL NOISE; SURFACE TREATMENT; TEMPERATURE; THERMOELASTICITY;

FORCE SENSOR; JOHNSON NOISE; MECHANICAL DISSIPATION; MECHANICAL QUALITY FACTOR; MICROMECHANICAL CANTILEVERS; MICROMECHANICAL RESONATOR; POLYSILICON; SURFACE LOSSES; THERMOELASTIC DISSIPATION; THERMOMECHANICAL NOISE;

MICROELECTROMECHANICAL DEVICES;

EID: 0033892144     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.825786     Document Type: Article

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