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Volumn 203-205, Issue , 2002, Pages 285-288
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Internal friction of copper thin layers on silicon substrates
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Author keywords
Copper films; Core diffusion; Dislocation relaxation; Internal friction
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Indexed keywords
AMORPHOUS MATERIALS;
COPPER;
CRYSTALLINE MATERIALS;
DAMPING;
DIFFUSION IN SOLIDS;
ELASTIC MODULI;
INTERNAL FRICTION;
METALLIC FILMS;
SILICON NITRIDE;
SILICON WAFERS;
SUBSTRATES;
THICKNESS MEASUREMENT;
ACTIVATION ENTHALPY;
COPPER FILM;
CORE DIFFUSION;
DISLOCATION RELAXATION;
INTERNAL FRICTION MEASUREMENT;
THIN FILMS;
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EID: 18744430060
PISSN: 10120386
EISSN: 16629507
Source Type: Journal
DOI: 10.4028/www.scientific.net/ddf.203-205.285 Document Type: Article |
Times cited : (3)
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References (17)
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