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Materials Transactions

Volumn 52, Issue 1, 2011, Pages 1-7

Effects of Cu self-capping and Ta capping on nanometer-sized Cu films sputter-deposited on β-Ta

(5) Tanimoto, Hisanori a Sugimori, Takayuki a Kumamoto, Shoichiro a Matsui, Hazuki a Mizubayashi, Hiroshi a

a UNIVERSITY OF TSUKUBA (Japan)

Author keywords

Capping effect; Copper; Grain boundary; Interface energy; Nanocrystalline structurte; Tantalum; Thin film

Indexed keywords

BARRIER LAYERS; CAPPING EFFECT; CU FILMS; CU(1 1 1); GRAIN-BOUNDARY ENERGY; GROWTH STAGES; INTERFACE ENERGY; NANO-CRYSTALLINE STRUCTURES; NANOCRYSTALLINE CU; NANOCRYSTALLINES; ROOM TEMPERATURE; SI(1 0 0); TEXTURE EVOLUTIONS;

GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; METALLIC FILMS; TANTALUM; TEXTURES; THIN FILMS; VAPOR DEPOSITION; X RAY DIFFRACTION;

COPPER;

EID: 79952269986 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.M2010286 Document Type: Article

Times cited : (3)

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