-
1
-
-
0942277277
-
An introduction to Cu electromigration
-
C.S. Hau-Riege An introduction to Cu electromigration Microelectron. Reliab. 44 2004 195 205
-
(2004)
Microelectron. Reliab.
, vol.44
, pp. 195-205
-
-
Hau-Riege, C.S.1
-
2
-
-
0019487986
-
Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
-
S. Vaidya, and A.K. Sinha Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films Thin Solid Films 75 1981 253 259
-
(1981)
Thin Solid Films
, vol.75
, pp. 253-259
-
-
Vaidya, S.1
Sinha, A.K.2
-
3
-
-
0036578069
-
Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited
-
Y.-L. Chin, B.-S. Chiou, and F. Wu Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor- deposited Jpn. J. Appl. Phys. 41 2002 3057 3064
-
(2002)
Jpn. J. Appl. Phys.
, vol.41
, pp. 3057-3064
-
-
Chin, Y.-L.1
Chiou, B.-S.2
Wu, F.3
-
4
-
-
0035914699
-
Copper wetting of a tantalum silicate surface: Implications for interconnect technology
-
X. Zhao, M. Leavy, N.P. Magtoto, and A. Kelber Copper wetting of a tantalum silicate surface: implications for interconnect technology Appl. Phys. Let. 79 2001 3479 3481
-
(2001)
Appl. Phys. Let.
, vol.79
, pp. 3479-3481
-
-
Zhao, X.1
Leavy, M.2
Magtoto, N.P.3
Kelber, A.4
-
5
-
-
2342544122
-
Texture and electromigration perfomance in damascene interconnects formed by reflow sputtered Cu film
-
K. Abe, Y. Harada, M. Yoshimaru, and H. Onoda Texture and electromigration perfomance in damascene interconnects formed by reflow sputtered Cu film J. Vac. Sci. Tech. B 22 2004 721 728
-
(2004)
J. Vac. Sci. Tech. B
, vol.22
, pp. 721-728
-
-
Abe, K.1
Harada, Y.2
Yoshimaru, M.3
Onoda, H.4
-
7
-
-
0001779424
-
Defect studies of thin layers by the vibrating-reed technique
-
B.S. Berry, and C. Pritchet Defect studies of thin layers by the vibrating-reed technique J. Physique (Paris) 42 1981 C5 1111-1122
-
(1981)
J. Physique (Paris)
, vol.42
-
-
Berry, B.S.1
Pritchet, C.2
-
10
-
-
1642312908
-
Elasticity study of nanostructured Al and Al-Si(Cu) films
-
Y. Kabe, H. Tanimoto, and H. Mizubayashi Elasticity study of nanostructured Al and Al-Si(Cu) films Mater. Trans. JIM 45 2004 119
-
(2004)
Mater. Trans. JIM
, vol.45
, pp. 119
-
-
Kabe, Y.1
Tanimoto, H.2
Mizubayashi, H.3
-
11
-
-
1642367443
-
Future scope of internal friction study - Mechanical spectroscopy on nanostructured metals
-
in Japanease
-
H. Mizubayashi, Future scope of internal friction study - mechanical spectroscopy on nanostructured metals, Kinzoku. 71 (2001) 869-873 (in Japanease).
-
(2001)
Kinzoku.
, vol.71
, pp. 869-873
-
-
Mizubayashi, H.1
-
13
-
-
0037012520
-
Elastic properties of thin silver films: Hexagonal model and influence of corrugation effects
-
R. Eberle, T. Kresser, and M. Pietralla Elastic properties of thin silver films: hexagonal model and influence of corrugation effects Thin Solid Films 408 2002 169 175
-
(2002)
Thin Solid Films
, vol.408
, pp. 169-175
-
-
Eberle, R.1
Kresser, T.2
Pietralla, M.3
-
14
-
-
27744491616
-
Elasticity study of nanostructured copper thin films
-
in press
-
H. Mizubayashi, K. Fujita, K. Fujiwara, H. Tanimoto, Elasticity study of nanostructured copper thin films, J. Metastable Nanocrystalline Mater., in press.
-
J. Metastable Nanocrystalline Mater.
-
-
Mizubayashi, H.1
Fujita, K.2
Fujiwara, K.3
Tanimoto, H.4
-
16
-
-
0037704668
-
Effect of substrate bias voltage on the thermal stability of Cu/Ta/Si structure deposited by ion beam deposition
-
J.-W. Lim, K. Mimura, K. Miyake, M. Yamashita, and M. Isshiki Effect of substrate bias voltage on the thermal stability of Cu/Ta/Si structure deposited by ion beam deposition Jpn. J. Appl. Phys. 42 2003 2780 2785
-
(2003)
Jpn. J. Appl. Phys.
, vol.42
, pp. 2780-2785
-
-
Lim, J.-W.1
Mimura, K.2
Miyake, K.3
Yamashita, M.4
Isshiki, M.5
-
18
-
-
2942585285
-
Residual stress and thermal stress observation in thin copper films
-
T. Hanabusa, K. Kusada, and O. Sakata Residual stress and thermal stress observation in thin copper films Thin Solid Films 459 2004 245 248
-
(2004)
Thin Solid Films
, vol.459
, pp. 245-248
-
-
Hanabusa, T.1
Kusada, K.2
Sakata, O.3
-
19
-
-
1142292391
-
Reversible stress changes at all stages of volmer-weber film growth
-
C. Friesen, S.C. Seel, and V. Thompson Reversible stress changes at all stages of volmer-weber film growth J. Appl. Phys. 95 2004 1011 1020
-
(2004)
J. Appl. Phys.
, vol.95
, pp. 1011-1020
-
-
Friesen, C.1
Seel, S.C.2
Thompson, V.3
-
20
-
-
27744496061
-
Characterization and mechanical properties of high-density nanocrystalline copper
-
Y. Akiniwa et al. (Eds.) Nagoya Congress Center, Nagoya, Japan OS06W0399 (4 pages)
-
H. Tanimoto, N. Yagi, T. Yamada, H. Mizubayashi, Characterization and mechanical properties of high-density nanocrystalline copper, in: Y. Akiniwa et al. (Eds.), Proceedings of International Conference on Advanced Technology in Experimental Mechanics 2003 (ATEM'03), Nagoya Congress Center, Nagoya, Japan, 2003, OS06W0399 (4 pages).
-
(2003)
Proceedings of International Conference on Advanced Technology in Experimental Mechanics 2003 (ATEM'03)
-
-
Tanimoto, H.1
Yagi, N.2
Yamada, T.3
Mizubayashi, H.4
-
21
-
-
0037235508
-
Characterization and determination of elastic property of high-density nanocrystalline gold prepared by gas-deposition method
-
H. Tanimoto, S. Sakai, E. Kita, and H. Mizubayashi Characterization and determination of elastic property of high-density nanocrystalline gold prepared by gas-deposition method Mater. Trans. 44 2003 94 103
-
(2003)
Mater. Trans.
, vol.44
, pp. 94-103
-
-
Tanimoto, H.1
Sakai, S.2
Kita, E.3
Mizubayashi, H.4
-
22
-
-
0036975096
-
Characteristic creep behavior of nanocrystalline (n-) metals found for high density n-gold
-
S. Sakai, H. Tanimoto, E. Kita, and H. Mizubayashi Characteristic creep behavior of nanocrystalline (n-) metals found for high density n-gold Phys. Rev. B 66 2002 214106 (9 pages)
-
(2002)
Phys. Rev. B
, vol.66
, pp. 214106
-
-
Sakai, S.1
Tanimoto, H.2
Kita, E.3
Mizubayashi, H.4
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