Copper wetting of a tantalum silicate surface: Implications for interconnect technology

Applied Physics Letters

Volumn 79, Issue 21, 2001, Pages 3479-3481

  Zhao, X ^a   Leavy, M ^a   Magtoto, N P ^a   Kelber, J A ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035914699     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1418025     Document Type: Article

References (23)

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