Anelasticity study on electromigration effect in Cu thin films

Materials Science and Engineering: A

Volumn 442, Issue 1-2 SPEC. ISS., 2006, Pages 342-346

  Mizubayashi, H ^a   Goto, K ^a   Ebisawa, T ^a   Tanimoto, H ^a  

^a UNIVERSITY OF TSUKUBA   (Japan)

Author keywords

Cu interconnects; Electromigration; Internal friction; Young's modulus

Indexed keywords

COPPER; CURRENT DENSITY; ELASTIC MODULI; ELECTROMIGRATION; INTERNAL FRICTION; MASS TRANSFER; NATURAL FREQUENCIES; TRANSPORT PROPERTIES; VIBRATIONS (MECHANICAL);

COMPOSITE VIBRATING REED METHOD; COPPER INTERCONNECTS; COPPER THIN FILMS;

THIN FILMS;

COPPER; CURRENT DENSITY; ELASTIC MODULI; ELECTROMIGRATION; INTERNAL FRICTION; MASS TRANSFER; NATURAL FREQUENCIES; THIN FILMS; TRANSPORT PROPERTIES; VIBRATIONS (MECHANICAL);

EID: 33751118037     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.02.227     Document Type: Article

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