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Applied Surface Science

Volumn 257, Issue 6, 2011, Pages 2303-2307

Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser

(5) Liu, L a Chang, C Y a Wu, Wenhsing a Pearton, S J a Ren, F a

a University of Florida (United States)

Author keywords

Excimer laser; Laser drill; SiC; Via holes

Indexed keywords

EXCIMER LASERS; SILICON CARBIDE;

4H-SIC SUBSTRATE; DRILLING RATES; LASER DRILL; LASER DRILLING; LINEARLY PROPORTIONAL; PULSE FREQUENCIES; UV-EXCIMER LASERS; VIA HOLE;

ARGON LASERS;

EID: 78650270961 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2010.09.093 Document Type: Article

Times cited : (11)

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