Influence of substrate biasing on (Al, Ti)N thin films deposited by a hybrid HiPIMS/DC sputtering process

IEEE Transactions on Plasma Science

Volumn 38, Issue 11 PART 1, 2010, Pages 3040-3045

  Guillaumot, A ^a   Lapostolle, F ^a   Langlade, C ^a   Billard, A ^a   Oliveira, J C ^b   Cavaleiro, A ^b   Dublanche Tixier, C ^c  

^a UNIVERSITÉ DE TECHNOLOGIE DE BELFORT MONTBÉLIARD   (France)

^b UNIVERSITY OF COIMBRA   (Portugal)

^c UNIVERSITY OF LIMOGES   (France)

Author keywords

(Al, Ti)N; chemical and structural properties; hybrid pulsed dc HiPIMS process; mechanical properties; morphology; thin films

Indexed keywords

(AL, TI)N; ALN; APPLIED VOLTAGES; HARDNESS ENHANCEMENT; HYBRID PROCESS; HYBRID PULSED-DC/HIPIMS PROCESS; INTERNAL STRESS; NEGATIVE BIAS; POOR ADHESION; POWER UNITS; PULSED DC; SPUTTERING PROCESS; SUBSTRATE BIASING; TITANIUM CONTENT; TITANIUM TARGETS;

ALUMINUM; ALUMINUM NITRIDE; BIAS VOLTAGE; COATINGS; DC POWER TRANSMISSION; DEPOSITION RATES; HARDENING; MORPHOLOGY; STRUCTURAL PROPERTIES; SUBSTRATES; THIN FILMS; TITANIUM; TITANIUM NITRIDE; VAPOR DEPOSITION;

MECHANICAL PROPERTIES;

EID: 78349305502     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2010.2052931     Document Type: Conference Paper

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