Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads

Journal of Materials Research

Volumn 19, Issue 10, 2004, Pages 2887-2896

  Date, M ^a   Tu, K N ^a   Shoji, T ^b   Fujiyoshi, M ^b   Sato, K ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HITACHI CABLE LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; ELECTROLESS PLATING; FRACTURE TOUGHNESS; GOLD; IMPACT TESTING; INTERFACES (MATERIALS); INTERMETALLICS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SURFACE REACTIONS;

BOND PADS; IMPACT RELIABILITY; INTERFACIAL REACTIONS; JOINT RELIABILITY; SOLDER BALLS;

TIN ALLOYS;

EID: 6344258511     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0371     Document Type: Article

References (26)

1. K.N. Tu and K. Zeng: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).
2. K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda: Heat resistance of Sn-9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 (2000).
3. K.S. Kim, Y.S. Kim, K. Suganuma, and H. Nakajima: Microstructure changes in Sn-Zn/Cu joints during heat-exposure. J. Jpn. Inst. Electron. Packag. 5, 666 (2002).
4. H.M. Lee, S.W. Yoon, and B.J. Lee: Thermodynamic prediction of interface phases at Cu/solder joints. J. Electron. Mater. 27, 1161 (1998).
5. B.J. Lee, N.M. Hwang, and H.M. Lee: Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 (1997).
6. P. Harris: Interfacial reactions of tin-zinc-bismuth alloys. Soldering Surf Mount Technol. 11, 46 (1999).
7. Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura, and T. Nagano: Influence of P content in electroless plated Ni-P alloy film on interfacial structures and strength between Sn-Zn solder and plated Au/Ni-P alloy film. Mater. Trans. 43, 1887 (2002).
8. S.P. Yu, H.J. Lin, M.H. Hon, and M.C. Wang: Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate. J. Mater. Sci.-Mater. Electron. 11, 461 (2000).
9. Y.C. Chan, M.Y. Chiu, and T.H. Chuang: Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates. Z. Metallkd. 93, 95 (2002).
10. M.Y. Chiu, S.S. Wang, and T.H. Chuang: Intermetallic compounds formed during between liquid Sn-8Zn-3Bi solders and Ni substrates. J. Electron. Mater. 31, 494 (2002).
11. I. Shohji, T. Nakamura, F. Mori, and S. Fujiuchi: Interface reaction and mechanical properties of lead-free Sn-Zn alloy/Cu joints. Mater. Trans. 43, 1797 (2002).
12. M. Nishiura, A. Nakayama, S. Sakatani, Y. Kohara, K. Uenishi, and K.F. Kobayashi: Mechanical strength and microstructure of BGA joints using lead-free solders. Mater. Trans. 43, 1802 (2002).
13. K.C. Hung, Y.C. Chan, H.C. Ong, P.L. Tu, and C.W. Tang: Effect of pinhole Au/Ni/Cu substrate on self-alignment of advanced packages. Mater. Sci. Eng. B 76, 87 (2000).
14. T. Morita, R. Kajiwara, K. Yamamoto, K. Sato, M. Date, T. Shoji, I. Ueno, and S. Okabe: Impact reliability of Pb-free BGA solder joints. Proceedings of the 16th JIEP Annual Meeting, (JIEP, Tokyo, Japan, 2002), p. 107.
15. T. Shoji, K. Yamamoto, R. Kajiwara, T. Morita, K. Sato, and M. Date: Interfacial reactions between Pb-free solders and Cu substrates, in Proceedings of the 16th JIEP Annual Meeting (JIEP, Tokyo, Japan, 2002), p. 97.
16. T. Lyman: Metals Handbook, 8th ed. (American Society for Metals, Materials Park, OH, 1973), Vol. 8.
17. T.B. Massalski and H.W. King: The lattice spacing relationships in H.C.P. ε and η phases in the systems Cu-Zn, Ag-Zn; Au-Zn and Ag-Cd. Acta Metall. 10, 1171 (1962).
18. J.P. Schaffer, A. Saxena, S.D. Antolovich, T.H. Sanders, Jr., and S.B. Warner: The Science and Design of Engineering Materials (The McGraw-Hill companies, New York, 1999), p. 384.
19. B.F. Dyson, T.R. Anthony, and D. Turnbull: Interstitial diffusion of copper in tin. J. Appl. Phys. 38, 3408 (1967).
20. 65 in tin. Phys. Rev. B 9, 1479 (1974).
21. G. Krautheim, A. Neidhardt, U. Reinhold, and A. Zehe: Impurity diffusion of Sn-113 and Sb-124 in copper. Phys. Lett. 72A, 181 (1979).
22. M.B. Dutt and S.K. Sen: Diffusion of zinc in copper and silver. Jpn. J. Appl. Phys. 18, 1025 (1979).
23. C.J. Thwaites, M.E. Warwick, and B. Scott: Metals Handbook, 9th ed. (American Society for Metals, Materials Park, OH, 1985), Vol. 9, p. 455.
24. T. Omi, S. Kokunai, and H. Yamamoto: Structure of amorphous Ni-P electrodeposits. Trans. Jpn. Inst. Metals 17, 370 (1976).
25. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson: Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 (1999).
26. Y.S. Kim, K.S. Kim, C.W. Hwang, and K. Suganuma: Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys. J. Alloys Compd. 352, 237 (2003).