Development of electronics Ni/Au plated build-up flip chip package with highly reliable solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1384-1392

  Yokomine, K ^a   Shimizu, N ^a   Miyamoto, Y ^a   Iwata, Y ^a   Love, D ^a   Newman, K ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CORROSION; ELECTROLESS PLATING; FLIP CHIP DEVICES; GOLD; NICKEL; NICKEL ALLOYS; PHOSPHORUS; RELIABILITY; SOLDERED JOINTS; SURFACE ROUGHNESS;

FLIP CHIP PACKAGE; NICKEL TIN ALLOY; SOLDERABILITY;

ELECTRONICS PACKAGING;

EID: 0034822476     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Investigation of under bump metallization systems for flip-chip assembles
2. Gold plating thickness and soldering reliability of solder balls for electroless gold plated TAB tape carrier
3. Electroless Ni-P/Pd/Au plating for semiconductor package substrate
4. A root cause failure mechanism for solder joint integrity of electroless nickel/immersion gold surface finishes