Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads

Journal of Materials Engineering and Performance

Volumn 17, Issue 1, 2008, Pages 134-140

  Chi, C C ^a   Tsao, L C ^a   Tsao, C W ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Aging; Ball shear strength; Intermetallics; Reflow; Sn 58Bi solder BGA

Indexed keywords

BALL SHEAR STRENGTH; CLEAVAGE FRACTURE; REFLOW; SN-58BI SOLDER BGA;

AGING OF MATERIALS; BEARING PADS; DUCTILE FRACTURE; INTERMETALLICS; SHEAR STRENGTH; SOLDERED JOINTS;

BALL GRID ARRAYS;

EID: 38149092349     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-007-9151-y     Document Type: Article

References (15)

1. W.J. Tomlinson, I. Collier, Mechanical Properties and Microstructures of Copper and Brass Joints Soldered with Eutectic Tin-Bismuth Solder, J. Mater. Sci. 22(5), 1835-1839 (1987)
2. Z. Mei, J.W. Morris Jr., Characterization of Eutectic Sn-Bi Solder Joints, J. Electron. Mater. 21(6), 599-607 (1992)
3. C.H. Raeder, L.E. Felton, V.A. Tanzi, D.B. Knorr, The Effect of Aging on Microstructure, Room-Temperature Deformation, and Fracture of Sn-Bi/Cu Solder Joints, J. Electron. Mater. 23(7), 611-617 (1994)
4. T.H. Chuang, S.Y. Chang, M.D. Cheng, S.S. Wang, Challenges for the Application of Lead-Free Solders on Ball Grid Array Packages, Bull. College Eng. N.T.U. 89, 101-110 (2003)
5. C. Chen, C.E. Ho, A.H. Lin, G.L. Luo, C.R. Kao, Long-Term Aging Study on the Solid-State Reaction Between 58Bi42Sn Solder and Ni Substrate, J. Electron. Mater. 29(10), 1200-1206 (2000)
6. M.Y. Chiu, S.Y. Chang, Y.H. Tseng, Y.C. Chan, T.H. Chuang, Characterization of Intermetallic Compounds Formed During the Interfacial Reactions of Liquid Sn and Sn-58Bi Solders with Ni Substrates, Zeitschrift fuer Metallkunde/Mater. Res. Adv. Tech. 93(3), 248-252 (2002)
7. S.K. Kang, R.S. Rai, S. Purushothaman, Interfacial Reactions During Soldering with Lead-Tin Eutectic and Lead (Pb)-Free Tin-Rich Solders, J. Electron. Mater. 25(7), 1113-1120 (1996)
8. B.L. Young, J.G. Duh, Interfacial Reaction and Microstructural Evolution for Electroplated Ni and Electroless Ni in the Under Bump Metallurgy with 42Sn58Bi Solder During Annealing, J. Electron. Mater. 30(7), 878-884 (2001)
9. A.M. Minor, J.W. Morris Jr., Inhibiting Growth of the Au0.5Ni0.5Sn4 Intermetallic Layer in Pb-Sn Solder Joints Reflowed on Au/Ni Metallization, J. Electron. Mater. 29(10), 1170-1174 (2000)
10. C.E. Ho, Y.M. Chen, C.R. Kao, Reaction Kinetics of Solder-Balls with Pads in BGA Packages During Reflow Soldering, J. Electron. Mater. 28(11), 1231-1237 (1999)
11. C.C. Chi and T.H. Chuang, Intermetallic Reactions in Sn-3.5Ag Solder Ball Grid Array Packages with Ag/Cu and Au/Ni/Cu Pads, J. Electron. Mater., in press
12. B. Meagher, D. Schwarz, M. Ohring, Compound Growth in Platinum/Tin-Lead Solder Diffusion Couples, J. Mater. Sci. 31(20), 5479-5486 (1996)
13. D.C. Yeh, Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin, H.B. Phys. Rev. Lett. 53(15), 1469-1472 (1984)
14. W. Lange, A. Hassner, Messung der Volumenselbstdiffusion im polykristallinen Zinn, Phys. Stat. Solidi. 1(1), 50-61 (1961)
15. C.L. Yu, Interfacial Reactions in Sn37Pb, Sn3Pb2Ag and Sn3.5Ag BGA Packages, Ph.D. Thesis, Institute of Materials Science and Engineering, National Taiwan University (2001)