Investigation of thermomechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 568-576

  Tsai, Ming Yi ^a   Hsu, C H Jeter ^b   Wang, C T Otto ^c  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c Taiwanese Army   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GLASS TRANSITION; INTERFEROMETRY; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS; TEMPERATURE; THERMAL CYCLING; THERMAL STRESS; THERMODYNAMIC PROPERTIES;

DIE STRESS; FLIP CHIP BALL GRID ARRAY PACKAGES; THERMAL CYCLING TEST; THERMOMECHANICAL BEHAVIOR; TWYMAN-GREEN INTERFEROMETRY; UNDERFILL CURING;

CHIP SCALE PACKAGES;

EID: 4444283043     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831817     Document Type: Article

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