The micro-impact fracture behavior of lead-free solder ball joints

Journal of Materials Research

Volumn 23, Issue 4, 2008, Pages 1057-1063

  Huang, Y L ^a   Lin, K L ^a   Liu, D S ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELONGATION; FRACTURE; FRACTURE ENERGY; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY;

IMPACT ENERGY; LEAD-FREE SOLDER JOINTS; SOLDER BALL JOINTS;

SOLDERED JOINTS;

EID: 42949110612     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0129     Document Type: Article

References (18)

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