Thermal cycling aging effect on the reliability and morphological evolution of SnAgCu solder joints

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 4, 2007, Pages 279-284

  Teo, J W Ronnie ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Intermetallic compound (IMC); Pb free solder; Thermal cycling loading

Indexed keywords

BALL GRID ARRAYS; INTERMETALLICS; METALLIZING; MICROELECTRONICS; THERMAL AGING; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS;

ACCELERATED TEMPERATURE CYCLING; LEAD-FREE SOLDER; THERMAL CYCLING AGING EFFECT; THERMAL CYCLING LOADING; UNDER BUMP METALLIZATION;

SOLDERED JOINTS;

EID: 35348818002     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.907575     Document Type: Article

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