A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration

IEEE Transactions on Industry Applications

Volumn 46, Issue 5, 2010, Pages 2046-2055

  Vagnon, Eric ^a   Jeannin, Pierre Olivier ^a,b   Crébier, Jean Christophe ^a,c   Avenas, Yvan ^a,d  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b UNIV GRENOBLE ALPES   (France)

^c CNRS   (France)

^d GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

Author keywords

Electrostatic analysis; packaging; power chip on chip (PCoC) approach; power drive interaction; press pack implementation; radiated field

Indexed keywords

CHIP-ON-CHIP; ELECTROSTATIC ANALYSIS; POWER/DRIVE INTERACTION; PRESS-PACK IMPLEMENTATION; RADIATED FIELD;

BUSBARS; CHIP SCALE PACKAGES; DIES; ELECTRIC POWER SYSTEMS; ELECTROMAGNETIC PULSE; ELECTROSTATICS; PRESSES (MACHINE TOOLS); THREE DIMENSIONAL;

ELECTRIC RECTIFIERS;

EID: 77956938358     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIA.2010.2057401     Document Type: Article

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