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Volumn , Issue , 2007, Pages 405-410

Comprehensive electro-thermal compact model of a 3.3kV-1200A IGBT-module

Author keywords

[No Author keywords available]

Indexed keywords

COMPACT MODEL; ELECTRO-THERMAL EFFECTS; PARASITIC EFFECT; RAILWAY TRACTION; SELF-HEATING; SILICON DIE; SIMULATION ENVIRONMENT; SIMULATION EXAMPLE;

EID: 77956933226     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POWERENG.2007.4380225     Document Type: Conference Paper
Times cited : (10)

References (13)
  • 3
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    • R. Kraus, P. Türkes, J. Sigg, "Physics-based Models of Power Semiconductor Devices for the Circuit Simulator Spice", PESC 98 Record.
    • PESC 98 Record
    • Kraus, R.1    Türkes, P.2    Sigg, J.3
  • 4
    • 0032071510 scopus 로고    scopus 로고
    • Status and trends of power semiconductor devices models for circuit simulation
    • May
    • R. Kraus, H. J. Mattausch, "Status and Trends of Power Semiconductor Devices Models for Circuit Simulation", IEEE Transactions on Power Electronics, Vol. 13, No. 3, May 1998.
    • (1998) IEEE Transactions on Power Electronics , vol.13 , Issue.3
    • Kraus, R.1    Mattausch, H.J.2
  • 5
    • 0028728169 scopus 로고
    • A precise model for the dc and transient characteristics of BJTs
    • June 20-25 Taipei, Taiwan
    • M. Bayer, R. Kraus, K. Hoffmann "A precise model for the dc and transient characteristics of BJTs", PESC 94, June 20-25, 1994, Taipei, Taiwan, Vol. I, S. 45-47.
    • (1994) PESC 94 , vol.1 , pp. 45-47
    • Bayer, M.1    Kraus, R.2    Hoffmann, K.3
  • 8
    • 0035333734 scopus 로고    scopus 로고
    • Physically based compact device models for circuit modelling applications
    • DOI 10.1016/S0026-2692(01)00013-1, PII S0026269201000131
    • P. A. Mawby, P. M. Igic, M. S. Towers, "Physically based compact device models for circuit modeling applications", Mcroelectronics Journal 32 (2002), 433-447. (Pubitemid 32529029)
    • (2001) Microelectronics Journal , vol.32 , Issue.5-6 , pp. 433-447
    • Mawby, P.A.1    Igic, P.M.2    Towers, M.S.3
  • 10
    • 24144462863 scopus 로고    scopus 로고
    • Extraction of accurate thermal compact models for fast electrothermal simulation of IGBT modules in hybrid electric vehicles
    • M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada, Y. Nishibe, "Extraction of accurate thermal compact models for fast electrothermal simulation of IGBT modules in Hybrid Electric Vehicles", Mcroelectronics Reliability 45(2005), 1694-1700.
    • (2005) Mcroelectronics Reliability , vol.45 , pp. 1694-1700
    • Ciappa, M.1    Fichtner, W.2    Kojima, T.3    Yamada, Y.4    Nishibe, Y.5
  • 12
    • 33748040759 scopus 로고    scopus 로고
    • New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions
    • DOI 10.1016/j.microrel.2006.07.058, PII S0026271406002034, Proceedings of the 17th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
    • D. Barlini, M. Ciappa, A. Castellazzi, M. Mermet-Guyennet, W. Fichtner, "New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions", Mcroelectronics Reliability 46 (2006), 1772-1777. (Pubitemid 44294695)
    • (2006) Microelectronics Reliability , vol.46 , Issue.9-11 , pp. 1772-1777
    • Barlini, D.1    Ciappa, M.2    Castellazzi, A.3    Mermet-Guyennet, M.4    Fichtner, W.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.