Double-sided liquid cooling for power semiconductor devices using embedded power packaging

IEEE Transactions on Industry Applications

Volumn 44, Issue 5, 2008, Pages 1645-1655

  Charboneau, Bryan C ^a,b   Wang, Fei ^c   van Wyk, Jacobus Daniel ^c   Boroyevich, Dushan ^d   Liang, Zhenxian ^e   Scott, Elaine P ^f   Tipton, C Wesley ^g  

^a UNIVERSITY OF MARYLAND   (United States)

^b EVI Inc   (United States)

^c Virginia Polytechnic Institute and State University   (United States)

^d UNIVERSITY OF JOHANNESBURG   (South Africa)

^e FORD MOTOR COMPANY   (United States)

^f SEATTLE PACIFIC UNIVERSITY   (United States)

^g U S ARMY RESEARCH LABORATORY   (United States)

Author keywords

Double sided cooling; Forced liquid convection; Power density; Semiconductor packaging

Indexed keywords

COOLING; EQUIPMENT TESTING; FLUID MECHANICS; MOSFET DEVICES; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES;

DOUBLE-SIDED COOLING; FORCED LIQUID CONVECTION; POWER DENSITY; SEMICONDUCTOR PACKAGING;

COOLING WATER;

EID: 53349101731     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIA.2008.2002270     Document Type: Article

References (19)

1. J. D. van Wyk and F. C. Lee, "Power electronics technology at the dawn of the new millenium-status and future," in Proc. 30th Annu. IEEE PESC, Jul. 1999, vol. 1, pp. 3-12.
2. I. Mudawar, "Assessment of high-heat-flux thermal management schemes," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 2, pp. 122-141, Jun. 2001.
3. S. Bontemps, A. Calmels, and C. Zardini, "Integral liquid cooled (ILC) high power module for efficient heat extraction," in Proc. IEEE Int. Workshop Integr. Power Packag., Sep. 1998, pp. 68-73.
4. C. Gillot, L. Meysenc, C. Schaeffer, and A. Bricard, "Integrated single and two-phase micro heat sinks under IGBT chips," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 3, pp. 384-389, Sep. 1999.
5. C. Gillot, C. Schaeffer, and A. Bricard, "Integrated micro heat sink for power multichip module," IEEE Trans. Ind. Appl., vol. 36, no. 1, pp. 217-221, Jan./Feb. 2000.
6. T.-Y. Lee, "Design optimization of an integrated liquid-cooled IGBT power module using CFD technique," IEEE Trans. Compon. Packag. Technol., vol. 23, no. 1, pp. 55-60, Mar. 2000.
7. S. Stefanescu, M. Mehregany, J. Leland, and K. Yerkes, "Micro jet array heat sink for power electronics," in Proc. 12th IEEE Int. Conf. Micro Electro Mech. Syst., Jan. 1999, pp. 165-170.
8. M. C. Shaw, J. R. Waldrop, S. Chandrasekaran, B. Kagalwala, X. Jing, E. R. Brown, V. J. Dhir, and M. Fabbeo, "Enhanced thermal management by direct water spray of high-voltage, high power devices in a three-phase, 18-hp AC motor drive demonstration," in Proc. 8th Intersoc. Conf. Therm. Thermomech. Phenom. Electron. Syst., May 2002, pp. 1007-1014.
9. T. Steiner and R. Sittig, "IGBT module setup with integrated micro-heat sinks," in Proc. 12th Int. Symp. Power Semicond. Devices ICs, May 2000, pp. 209-212.
10. C. Gillot, C. Schaeffer, C. Massit, and L.Meysenc, "Double-sided cooling for high power IGBT modules using flip chip technology," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 4, pp. 698-704, Dec. 2001.
11. B. Ozmat, C. S. Korman, and R. Fillion, "An advanced approach to power module packaging," in Proc. Int. Workshop Integr. Power Packag., Jul. 2000, pp. 8-11.
12. A. Sawle, M. Standing, T. Sammon, and A.Woodworth, "DirectFET™ - A proprietary new source mounted power package for board mounted power," International Rectifier, 2001, Surrey, U.K. [Online]. Available: http://www.irf.com/technical-info/papers.html
13. T. Jomard, U. Eckes, E. Touvier, and M. Lallemand, "Modelling of the two-phase cooling of a power semiconductor and its associated evaporators," in Proc. 8th Annu. IEEE Semicond. Therm. Meas. Manage. Symp., Feb. 1992, pp. 20-24.
14. Z. Liang, J. D. van Wyk, F. C. Lee, D. Boroyevich, E. P. Scott, Z. Chen, and Y. Pang, "Integrated packaging of a 1 kW switching module using a novel planar integration technology," IEEE Trans. Power Electron. vol. 19, no. 1, pp. 242-250, Jan. 2004.
15. J. Yin, J. D. van Wyk, W. G. Odendaal, and Z. Liang, "Design and optimization of embedded power chip modules for double-sided cooling," in Conf. Rec. 39th IEEE IAS Annu. Meeting, Oct. 2004, vol. 3, pp. 1545-1551.
16. Y. F. Pang, E. P. Scott, Z. Liang, and J. D. van Wyk, "Experimental study on the double-sided cooling for integrated power electronics modules," in Proc. Annu. Center Power Electron. Syst. Conf., Apr. 2005, pp. 273-280.
17. Z. Liang, B. Lu, J. D. van Wyk, and F. C. Lee, "Integrated CoolMOS FET/SiC-diode module for high performance power switching," IEEE Trans. Power Electron., vol. 20, no. 3, pp. 273-280, May 2005.
18. F. P. Incropera and D. P. Dewitt, Fundamentals of Heat and Mass Transfer, 5th ed. New York: Wiley, 2002.
19. H. Baumann, P. Heinemeyer, W. Staiger, M. Topfer, K. Unger, and D. Muller, "Optimized cooling systems for high-power semiconductor devices," IEEE Trans. Ind. Electron., vol. 48, no. 2, pp. 298-306, Apr. 2001.