Packaging and integration technologies for future high-frequency power supplies

IEEE Transactions on Industrial Electronics

Volumn 51, Issue 6, 2004, Pages 1305-1312

  Mathúna, Seán Cian Ó ^a   Byrne, Patrick ^a   Duffy, Gerald ^a   Chen, Weimin ^a   Ludwig, Matthias ^a   O'Donnell, Terence ^a   McCloskey, Paul ^a   Duffy, Maeve ^b  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b NATIONAL UNIVERSITY OF IRELAND   (Ireland)

Author keywords

Integrated magnetics; Power packaging; Power supplies; Reviews; Semiconductor device packaging

Indexed keywords

ELECTRIC POWER SUPPLIES TO APPARATUS; POWER CONVERTERS; POWER ELECTRONICS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING SILICON;

INTEGRATED MAGNETICS; POWER PACKAGING; SEMICONDUCTOR DEVICE PACKAGING;

ELECTRONICS PACKAGING;

EID: 10044224822     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIE.2004.837904     Document Type: Article

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