Study and realization of a low force 3D press-pack power module

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn , Issue , 2008, Pages 1048-1054

  Vagnon, E ^a   Crebier, J C ^a   Avenas, Y ^a   Jeannin, P O ^a  

^a UNIV GRENOBLE ALPES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; KETONES; METALS; POWER ELECTRONICS; PRESSES (MACHINE TOOLS); STANDARDS;

ELECTRICAL COMPONENTS; GENERIC ELEMENT; IMPLEMENTATION STRATEGIES; METAL INTERFACES; POWER CHIPS; POWER LEVELING; POWER MODULES; THERMAL CONTACT RESISTANCE;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 52349102578     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2008.4592068     Document Type: Conference Paper

References (15)

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