Industrial and lab-scale power module technologies: A review

IECON Proceedings (Industrial Electronics Conference)

Volumn , Issue , 2006, Pages 2426-2431

  Menager L ^a   Martin, C ^a   Allard, B ^a   Bley, V ^b  

^a Univ Claude Bernard Lyon1   (France)

^b d'Hydraulique et des Telecommunications   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; INDUSTRIAL ELECTRONICS; WIRE;

3D PACKAGING; HIGH POWER DENSITY; HIGH SWITCHING FREQUENCIES; INDUSTRIAL POWER; INTERCONNECT TECHNOLOGY; LITERATURE DATA; NICHE MARKETS; WIRE BONDING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 50249094994     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IECON.2006.347559     Document Type: Conference Paper

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