Electromechanical characteristics of a bondless pressure contact IGBT

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1999, Pages 312-317

  Wakeman, F ^a   Billett, K ^a   Irons, R ^a   Evans, M ^a  

^a Littelfuse Ireland Ltd   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GATES (TRANSISTOR); INTEGRATED CIRCUIT LAYOUT;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

BIPOLAR TRANSISTORS;

EID: 0032686292     PISSN: None     EISSN: None     Source Type: None    
DOI: 10.1109/apec.1999.749659     Document Type: Article

References (12)

1. A.Hamidi, G.Coquery and R.Lallemand, "Reliability of high power IGBT modules testing on thermal fatigue effects due to traction cycles", EPE'97, Trondheim Norway, 1997, pp 3.118 - 3.123.
2. P. Jacob, M. Held, P. Scacco and W. Wu, "Reliability testing and analysis of IGBT power semiconductor modules", 1EE - IGBT propulsion drives Colloquium, London UK, 1995, pp 4/1 - 4/5.
3. W. Wu, M. Held, P. Jacob, P. Scacco and A Birolini, "Thermal stress related packaging failure in power IGBT modules", ISPSD'95, Yokohama Japan, 1995, pp 330 - 334.
4. W. Wu, M. Held, P. Jacob, P. Scacco and A.Birolini, "Investigation on the long term reliability of power IGBT modules", ISPSD'95, Yokohama Japan, 1995, pp 443 - 448.
5. M.Hiyoshi, S.Yanagisawa, K.Nishitani, K.Kotake, H.Matsuda, S.Teramae, Y.Baba, "A 1000A 2500V pressure mount RC-IGBT", EPE'95, Sevillia Spain, 1995, pp 1.051 - 1.056.
6. Y.Seki, Y.Takahashi, T.Koga, M.lchijyou and H.Kirihata, "Power pack IGBT: High power (2.5kV, IkA) RC-IGBT with highly reliable flat package"EPE'95, Sevillia Spain, 1995, Late paper.
7. H.Matsuda, M.Hiyoshi and N.Kawamura, "Pressure contact assembley technology of high power devices" ISPSD'97, Weimar Germany, 1997, pp 17-24.
8. Y.Takahashi, K.Yoshikawa, T.Koga, M.Soutome, T.Takano, H.Kirihata and Y.Seki, "Ultra high-power 2.5kV-1800A power pack IGBT", ISPSD '97, Weimar Germany, 1997, pp 233 - 236.
9. M.Hiyoshi and K.Nishitani," 3.3kV and 2.5kV Press Pack IGBT Switching performance and mechanical reliability", PCIM - Europe, Nuremberg Germany, 1997, pp 205 to 215.
10. G.Coquery, R.Lallemand, D.Wagner and P.Gibard, "Reliability of 400A IGBT modules for traction convereters contribution on the power thermal fatigue influence on life expectancy", EPE'97, Sevillia Spain 1995, pp 1.060 to 1.065.
11. K.Sommer, J.Gottert, G.Lefranc and R.Spanke, "Multichip high power IGBT modules for traction and industrial applications", EPE'97, Trondheim Norway, 1997, pp 1.112 to 1.116.
12. S. Duong, C. Schaeffer, F. Sarrus and C. Mulertt, "Investigation on fuses against case explosion" PCIM - Europe, Nuremberg Germany, 1997, pp 123 to 132.