From packaging to "un"-packaging - Trends in power semiconductor modules

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2008, Pages 12-19

  Stockmeier, Thomas ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

POWER MODULES; POWER SEMICONDUCTOR MODULES;

AUTOMOBILE ELECTRONIC EQUIPMENT; CHIP SCALE PACKAGES; COMPUTER NETWORKS; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT MANUFACTURE; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR MATERIALS; SEMICONDUCTOR SWITCHES;

ELECTRONICS PACKAGING;

EID: 51549116666     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2008.4538886     Document Type: Conference Paper

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