Solder bumping methods for flip chip packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 240-247

  Rinne, Glenn A ^a  

^a MCNC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; VAPOR DEPOSITION;

LIQUID PHASE DEPOSITION; SOLDER BUMPING METHODS; SOLID PHASE DEPOSITION;

SOLDERING;

EID: 0030678671     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (46)