Nano copper wires interconnection for three - dimensional integration in power electronics

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn , Issue , 2008, Pages 278-281

  Luan, Q H ^a   Bley, V ^a   Lebey, T ^a   Schlegel, B ^a   Menager L ^a  

^a UNIVERSITÉ PAUL SABATIER   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC WIRE; ELECTROPLATING; ENERGY CONSERVATION; METALLIZING; METALS; NANOSTRUCTURES; NANOWIRES; THREE DIMENSIONAL; WIRE;

COPPER ELECTROPLATING; COPPER NANO WIRES; ELECTRICAL INTERCONNECTIONS; LOW-TEMPERATURE PROCESSING; METAL SURFACES; NANO-COPPER; POROUS ALUMINA MEMBRANE; SAVING ENERGY; THREE-DIMENSIONAL INTEGRATION;

POWER ELECTRONICS;

EID: 52349102800     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2008.4591940     Document Type: Conference Paper

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