Electromagnetic considerations for designing double-sided power modules

IEEE Transactions on Industry Applications

Volumn 45, Issue 2, 2009, Pages 871-879

  Mandray, Sylvain ^a   Guichon, Jean Michel ^a   Schanen, Jean Luc ^a   Mermet Guyennet, Michel ^b   Dienot, Jean Marc ^b,c  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b ALSTOM   (France)

^c University Institute of Technology   (France)

Author keywords

Electromagnetic compatibility; Hybrid integrated circuit interconnections; Hybrid integrated circuit packaging; Power electronics; Printed circuit layout

Indexed keywords

CAPACITIVE EFFECTS; COMMON-MODE EMISSIONS; DIRECT BONDS; ELECTROMAGNETIC BEHAVIORS; HIGH THERMALS; HYBRID INTEGRATED CIRCUIT INTERCONNECTIONS; HYBRID INTEGRATED CIRCUIT PACKAGING; INTERNAL COUPLINGS; METALIZATIONS; POWER MODULES; PRINTED CIRCUIT LAYOUT;

ELECTRIC FUSES; ELECTRIC INVERTERS; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUITS; POWER ELECTRONICS; PRINTED CIRCUITS;

INTEGRATED CIRCUIT LAYOUT;

EID: 64049113598     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIA.2009.2013558     Document Type: Article

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