Development and characterization of rigid-flex interface

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1836-1840

  Lu, Su Tsai ^a   Lo, Wei Chung ^a   Chen, Tai Hong ^a   Chen, Yu Hua ^a   Chang, Shu Ming ^a   Huang, Yu Wei ^a   Lee, Yuan Chang ^a   Kuo, Tzu Ying ^a   Shih, Ying Ching ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; DEFORMATION; ELECTRONICS PACKAGING; GLASS; MOBILE TELECOMMUNICATION SYSTEMS; SUBSTRATES;

GLASS SUBSTRATE; RIGID-FLEX PACKAGING; STRETCHABLE INTERCONNECT; ULTRA THIN DIE;

FLAT PANEL DISPLAYS;

EID: 33845564084     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645909     Document Type: Conference Paper

References (5)

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2. Jokinen, E., Ristolainen E., "Anisotropic conductive film flip chip joining using thin chips" Microelectronics Reliability, Volume: 42, 2002, pp. 1913-1920
3. Chen, S. L., Kuo, T. Y., Hu, H. T., Lin, J. R., Yu, S. P., "The evaluation of wafer thinning and singulating process to enhance chip strength" IEEE ECTC, 2005, pp. 1526-1530
4. Wagner, S., "Stretchable conductors on elastomeric substrates" Applied Physics Letters, vol 82, April, 2003, pp. 1514
5. Chow, E. M., Chua, C., Hantschel, T., Schuylenbergh, K. V., Fork D. K., "Solder-free pressure contact microsprings in high-density flip-chip packages" IEEE ECTC, 2005, pp. 1119-1126