Innovative packaging concepts for ultra thin integrated circuits

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1034-1039

  Klink, Gerhard ^a   Feil, Michael ^a   Ansorge, Frank ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a Munich Division   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTRONICS; MICROPROCESSOR CHIPS; SILICON WAFERS; THIN FILM CIRCUITS;

FLAT PACKAGING TECHNOLOGIES; ULTRATHIN INTEGRATED CIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034822372     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927940     Document Type: Article

References (8)

1. Thin silicon chips and ACF connection technology for contactless IC cards
2. Ultra thin ICs open new dimensions for microelectronic systems
3. Three dimensional metallization for vertically integrated circuits
4. New process scheme for wafer thinning and stress-free separation of ultra thin ICs
5. New dicing and thinning concept improves mechanical reliability of ultra thin silicon
6. Assembly of ultra thin and flexible ICs
7. Thin chip integration - A novel technique for manufacturing three dimensional IC-packages