40μm die strength characterization

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 328-337

  Heng, Lem Tien ^a   Fei, Cheong Choke ^a   Subaramaniym, Senivasan ^a  

^a Infineon Technologies Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DRY ETCHING; ELECTRONICS PACKAGING; FRACTOGRAPHY; FRACTURE MECHANICS; LASERS; NONMETALS; PLASMA DIAGNOSTICS; PLASMA ETCHING; PLASMAS; RAMAN SCATTERING; RAMAN SPECTROSCOPY; RESIDUAL STRESSES; SPECTRUM ANALYSIS; STRENGTH OF MATERIALS; SURFACE TREATMENT;

COMPRESSIVE RESIDUAL STRESS; DICING METHODS; DIE CRACKS; DIE STRENGTHS; ETCHING TREATMENTS; FRACTURE MODES; LASER DICING; MECHANICAL DICING; MICRO-RAMAN SPECTROSCOPIES; SILICON DIES; TENSILE RESIDUAL STRESS; TENSILE TESTERS; THREE-POINT BENDING; THREE-POINT BENDING TESTS;

DIES;

EID: 63049083552     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763456     Document Type: Conference Paper

References (11)

1. Desmond Y.R. Chong, W.E Lee, B.K. Lim, John H.L. Pang, T.H. Low, "Mechanical Characterization in Failure Strength of Silicon Dice", Inter Society Conference on Thermal Phenomena, 2004, pp. 203-210.
2. J.D. Wu, C.Y. Huang, C.C Liao, "Fracture Strength Characterization and Failure Analysis of Silicon Die", Microelectronics Reliability 43, 2003, pp. 269-277.
3. Bivragh Majeed, Indrajit Paul, Kafil M Razeeb, John Barton, and Sean C O'Mathuna. "Mircrostructural, Mechanical, Fractural and Electrical Characterization of Thinned and Singulated Silicon Test Die", Journal of Micro Mechanics and Micro Engineering 16, 2006, pp. 1519-1529.
4. Shoulung Chen, C.Z. Tsai, Enboa Wu, I.G. Shih and Y.N Chen. "Study on the Effects of Wafer Thinning and Dicing on Chip Strength", IEEE Transactions on Advanced Packaging, Vol. 29, No. 1, February 2006, pp. 149-157.
5. *, Hyeon Hwang, Eun-Chul Ahn, Qiang Chen, Pyoungwan Kim, Teakhoon Lee, Myeongkee Chung, Taegyeong Chung, "Laser Dicing and Subsequent Die Strength Enhancement Technologies for Ultra Thin Wafer", Electronics Components and Technology Conference, 2007, pp. 761-766.
6. Werner Kroeninger, Franco Mariani, "Thinning and Singulation of Silicon: Root Causes of the Damage in Thin Chips", Electronic Components and Technology Conference, 2006, pp. 1317-1322.
7. Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada, "Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength", Electronics Components and Technology Conference, 2006, pp. 1623-1627.
8. Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu, Jyh-Rong Lin, Shan-Pu Yu, "The Evaluation of Wafer Thinning and Singulating Processes to Enhance Chip Strength", Electronics Components and Technology Conference, 2005, pp. 1526-1530.
9. Peter Heinze, Martin Amberger, Therese Chabert, "Five-Side Stress Relief - The method to get the "Perfect Die", Advanced Packaging Conference, SEMICON Europa, Stuttgart, Germany, 10-11 Oct 2007.
10. Ingrid De Wolf. "Micro-Raman Spectroscopy to Study Local Mechanical Stress in Silicon Integrated Circuits", Semiconductor Science Technology 11, 1996, pp. 139-154.
11. Yilan Kang, Yu Qiu, Zhenkun Lei, Ming Hu. "An Application of Raman Spectroscopy on the Measurement of Residual Stress in Porous Silicon", Optics and Lasers in Engineering 43, 2005, pp. 847-855.