Investigations of strength properties of ultra-thin silicon

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 105-111

  Schönfelder, Stephan ^a   Bagdahn, Jörg ^a   Ebert, Matthias ^a   Petzold, Matthias ^a   Bock, Karlheinz ^b   Landesberger, Christof ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FABRICATION; LIGHT EMITTING DIODES; SILICON; SILICON WAFERS;

BACK THINNING TECHNOLOGIES; DICING-BY-THINNING; DRY-ETCHED TRENCHES; WEIBULL THEORY;

THIN FILMS;

EID: 33745683912     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502783     Document Type: Conference Paper

References (5)

1. C. Landesberger, G. Klink, G. Schwinn, R. Aschenbrenner, "New Dicing and Thinning Concept Improves Mechanical Reliability of Ultra Thin Silicon", Proc. Int. Symp. on Advanced Packaging Materials, Braselton, Georgia, March 2001
2. rd International Workshop "Thin Semiconductor Devices - Manufacturing and Applications" [CD-ROM], 25.11.2002
3. th International Workshop "Thin Semiconductor Devices - Manufacturing and Applications" [CD-ROM], 01.12.2004
4. C. Bohm, T. Hauck, W.-H. Müller, A. "Probability of silicon fracture in molded packages [ICs]", Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004, Brussels, Belgium, 10-12 May 2004
5. ASTM C 1239-95, "Reporting Uniaxial Strength Data and Estimating Weibull Distribution Parameters for Advanced Ceramics", November 1995